18604203. CONFIGURABLE MEMORY DIE CAPACITANCE simplified abstract (Micron Technology, Inc.)
Contents
- 1 CONFIGURABLE MEMORY DIE CAPACITANCE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CONFIGURABLE MEMORY DIE CAPACITANCE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about Memory Die Capacitance
- 1.11 Original Abstract Submitted
CONFIGURABLE MEMORY DIE CAPACITANCE
Organization Name
Inventor(s)
Jingwei Cheng of Shanghai (CN)
CONFIGURABLE MEMORY DIE CAPACITANCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18604203 titled 'CONFIGURABLE MEMORY DIE CAPACITANCE
Simplified Explanation
The patent application describes methods, systems, and devices for configurable memory die capacitance. A memory device includes a capacitive component with capacitors and switching components that can selectively couple the capacitors with an input/output pad.
- Memory device with configurable memory die capacitance
- Capacitive component with capacitors and switching components
- Selective coupling of capacitors with input/output pad
- Activation of switching components individually or in coordination
- Configuration based on signaling from a host device
Key Features and Innovation
- Memory device with configurable capacitance
- Capacitive component with capacitors and switching components
- Selective coupling of capacitors with input/output pad
- Activation of switching components for configuration
- Integration of capacitive component, input/output pad, and input buffer in the same die
Potential Applications
- Memory devices
- Integrated circuits
- Electronic devices requiring configurable memory capacitance
Problems Solved
- Efficient memory die capacitance configuration
- Flexibility in adjusting capacitance levels
- Enhanced performance in memory devices
Benefits
- Improved memory device performance
- Flexibility in memory capacitance configuration
- Enhanced integration in electronic devices
Commercial Applications
Memory Device with Configurable Capacitance: Enhancing Performance and Flexibility in Electronic Devices
Questions about Memory Die Capacitance
How does configurable memory die capacitance improve memory device performance?
Configurable memory die capacitance allows for flexibility in adjusting capacitance levels, leading to enhanced performance in memory devices by optimizing capacitance based on specific requirements.
What are the potential applications of memory devices with configurable capacitance?
Memory devices with configurable capacitance can be used in various electronic devices, integrated circuits, and systems that require flexible memory capacitance configurations for optimal performance.
Original Abstract Submitted
Methods, systems, and devices for configurable memory die capacitance are described. A memory device may include a capacitive component, which may include one or more capacitors and associated switching components. The capacitive component may be coupled with an input/output (I/O) pad and an associated input buffer, and the one or more capacitors of the capacitive component may be selectively couplable with the I/O pad via the switching components. Switching components may be activated individually, in coordination, or not at all, such that one, multiple, or none of the capacitors may be coupled with the I/O pad. The capacitive component, I/O pad, and input buffer may be included in a same die of the memory device. In some cases, a configuration of the capacitive component may be based on signaling received from a host device.
