18603779. INTEGRATED CIRCUIT PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
INTEGRATED CIRCUIT PACKAGES
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chien-Hsun Chen of Zhutian Township (TW)
Jiun Yi Wu of Zhongli City (TW)
INTEGRATED CIRCUIT PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18603779 titled 'INTEGRATED CIRCUIT PACKAGES
The abstract describes a device with a semiconductor device and a redistribution structure consisting of multiple layers and features for grounding and transmission lines.
- The device includes a semiconductor device and a redistribution structure.
- The redistribution structure comprises a first dielectric layer with grounding features and transmission lines.
- The transmission lines are electrically coupled to the semiconductor device and are laterally disposed between grounding features.
- A second dielectric layer covers the grounding features, transmission lines, and includes a third grounding feature.
- The third grounding feature is physically and electrically coupled to the first and second grounding features.
- The transmission lines extend continuously along the length of the third grounding feature.
Potential Applications: - This technology can be used in high-frequency applications where signal integrity is crucial. - It can be applied in the telecommunications industry for improved data transmission. - The device can be utilized in radar systems for enhanced signal processing.
Problems Solved: - Ensures proper grounding and signal transmission in semiconductor devices. - Helps in reducing signal interference and maintaining signal integrity. - Enhances the overall performance of high-frequency electronic systems.
Benefits: - Improved signal quality and reliability. - Enhanced performance of semiconductor devices. - Reduction in signal interference and noise.
Commercial Applications: Title: "Enhancing Signal Integrity in Semiconductor Devices: Commercial Applications and Market Implications" This technology can be commercialized in the telecommunications, radar, and high-frequency electronics industries. It can lead to the development of more efficient and reliable electronic systems, attracting potential customers looking for high-performance solutions.
Questions about the technology: 1. How does this technology improve signal integrity in semiconductor devices? 2. What are the potential market implications of implementing this technology in high-frequency applications?
Original Abstract Submitted
In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.
