18603549. Channel Manufacturing Method simplified abstract (SEIKO EPSON CORPORATION)
Contents
Channel Manufacturing Method
Organization Name
Inventor(s)
Junichi Okamoto of Shiojiri (JP)
Channel Manufacturing Method - A simplified explanation of the abstract
This abstract first appeared for US patent application 18603549 titled 'Channel Manufacturing Method
Simplified Explanation: The patent application describes a method for manufacturing a channel by forming a slit and a recess on a substrate, applying adhesive, and bonding another substrate to it.
- **Forming a slit and a recess on a substrate**
- **Applying adhesive to the substrate**
- **Bonding another substrate to the first substrate**
Key Features and Innovation:
- Method for creating channels on substrates
- Use of adhesive for bonding substrates
- Precise formation of slits and recesses
Potential Applications:
- Microfluidic devices
- Electronic components
- Medical devices
Problems Solved:
- Precise bonding of substrates
- Creating channels with accuracy
- Ensuring secure connections
Benefits:
- Improved manufacturing process
- Enhanced product performance
- Increased durability of components
Commercial Applications: The technology can be used in industries such as electronics, healthcare, and research for creating precise channels and connections in various devices.
Questions about Channel Manufacturing: 1. How does the method ensure the accurate formation of slits and recesses? 2. What are the potential challenges in bonding substrates using this technique?
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Original Abstract Submitted
There is provided a channel manufacturing method for performing a first forming step of forming, on a first surface of a first substrate, a slit and a first recess to be separated from each other, a first transfer step of transferring a first adhesive applied to a first substrate for application to the first surface of the first substrate, and a first bonding step of bonding a second substrate to the first surface of the first substrate via the first adhesive.
