18603181. OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
Contents
OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Advanced Semiconductor Engineering, Inc.
Inventor(s)
OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18603181 titled 'OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
The abstract describes an optoelectronic package structure that includes a carrier, an electronic component, a photonic component, and a first power supply path in the carrier. The electronic component is placed over a first region of the carrier, with a first power supply path connecting the electronic component.
- The optoelectronic package structure consists of a carrier, electronic component, and photonic component.
- The electronic component is positioned on a first region of the carrier.
- A first power supply path is established to connect the electronic component within the structure.
Potential Applications: - This technology can be used in the development of advanced optoelectronic devices. - It can be applied in telecommunications, data transmission, and optical networking systems.
Problems Solved: - Provides a compact and efficient way to integrate electronic and photonic components. - Ensures reliable power supply connections for the electronic component.
Benefits: - Improved performance and reliability of optoelectronic devices. - Enhanced functionality and integration of electronic and photonic components.
Commercial Applications: Title: Optoelectronic Package Structure for Advanced Devices This technology can be utilized in the production of high-speed data transmission equipment, optical sensors, and telecommunications devices. It has the potential to revolutionize the optoelectronics industry by enabling more compact and efficient devices.
Questions about Optoelectronic Package Structure: 1. How does the integration of electronic and photonic components benefit optoelectronic devices? - The integration improves performance, efficiency, and reliability of optoelectronic devices by streamlining the connection between electronic and photonic components. 2. What are the potential commercial applications of this technology? - This technology can be used in telecommunications, data transmission, and optical networking systems, as well as in the development of advanced optoelectronic devices.
Original Abstract Submitted
An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.
