18603099. STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
Contents
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Osvaldo Jorge Lopez of Annandale NJ (US)
Jonathan Almeria Noquil of Plano TX (US)
Satyendra Singh Chauhan of Murphy TX (US)
Bernardo Gallegos of McKinney TX (US)
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18603099 titled 'STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
Simplified Explanation: The patent application describes an apparatus with a semiconductor device die flip chip mounted on a package substrate, forming solder joints within recesses on the substrate.
- The apparatus includes a package substrate with a planar die mount surface.
- Recesses extend into the planar die mount surface.
- A semiconductor device die flip chip is mounted on the package substrate on the planar die mount surface.
- The semiconductor device die has post connects with proximate ends on bond pads on its active surface.
- The post connects extend to distal ends away from the semiconductor device die with solder bumps.
- The solder bumps form solder joints to the package substrate within the recesses.
Potential Applications: 1. Electronics manufacturing for various devices. 2. Semiconductor industry for improved chip mounting processes.
Problems Solved: 1. Enhanced connectivity between semiconductor device die and package substrate. 2. Improved reliability of solder joints in electronic components.
Benefits: 1. Increased efficiency in chip mounting processes. 2. Enhanced durability and longevity of electronic devices.
Commercial Applications: The technology can be utilized in the production of consumer electronics, automotive electronics, and telecommunications equipment, improving the overall performance and reliability of these devices.
Prior Art: Prior art related to this technology can be found in patents and research papers on semiconductor packaging and flip chip mounting techniques.
Frequently Updated Research: Researchers are constantly exploring new materials and techniques to further enhance the performance and reliability of flip chip mounting processes in semiconductor devices.
Questions about Semiconductor Device Die Flip Chip Mounting: 1. How does the apparatus described in the patent application improve the connectivity between the semiconductor device die and the package substrate? 2. What are the potential implications of using this technology in various industries beyond electronics manufacturing?
Original Abstract Submitted
In a described example, an apparatus includes: a package substrate having a planar die mount surface; recesses extending into the planar die mount surface; and a semiconductor device die flip chip mounted to the package substrate on the planar die mount surface, the semiconductor device die having post connects having proximate ends on bond pads on an active surface of the semiconductor device die, and extending to distal ends away from the semiconductor device die having solder bumps, wherein the solder bumps form solder joints to the package substrate within the recesses.
