18602718. Package-On-Package Device simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
Package-On-Package Device
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Ming-Fa Chen of Taichung City (TW)
Sung-Feng Yeh of Taipei City (TW)
Hsien-Wei Chen of Hsinchu (TW)
Package-On-Package Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 18602718 titled 'Package-On-Package Device
The abstract of the patent application describes a package with a redistribution structure, a die package, and a semiconductor device connected through various bonding techniques and materials.
- The package includes a redistribution structure with a die package on one side, connecting a first die to a second die using metal-to-metal and dielectric-to-dielectric bonding.
- A dielectric material covers the first and second dies, surrounding the first die.
- A first through via extends through the dielectric material, connecting to the first die and a first via of the redistribution structure.
- A semiconductor device on the first side of the redistribution structure includes a conductive connector, with a second via of the redistribution structure contacting the connector.
- A first molding material surrounds the die package and the semiconductor device, with a package through via extending through to contact a third via of the redistribution structure.
- Potential Applications:
This technology can be applied in the manufacturing of advanced semiconductor packages for various electronic devices.
- Problems Solved:
This innovation addresses the need for efficient and reliable connections between dies and semiconductor devices in a package.
- Benefits:
- Improved connectivity and performance in semiconductor packages - Enhanced reliability and durability of electronic devices - Potential for miniaturization and increased functionality in electronic products
- Commercial Applications:
The technology can be utilized in the production of smartphones, tablets, laptops, and other consumer electronics where compact and high-performance semiconductor packages are required.
- Questions about the Technology:
1. How does the metal-to-metal bonding technique improve the connectivity between dies in the package? 2. What are the advantages of using a dielectric material to cover the dies in the package?
Original Abstract Submitted
A package includes a redistribution structure, a die package on a first side of the redistribution structure including a first die connected to a second die by metal-to-metal bonding and dielectric-to-dielectric bonding, a dielectric material over the first die and the second die and surrounding the first die, and a first through via extending through the dielectric material and connected to the first die and a first via of the redistribution structure, a semiconductor device on the first side of the redistribution structure includes a conductive connector, wherein a second via of the redistribution structure contacts the conductive connector of the semiconductor device, a first molding material on the redistribution structure and surrounding the die package and the semiconductor device, and a package through via extending through the first molding material to contact a third via of the redistribution structure.
