18602553. SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS simplified abstract (MICRON TECHNOLOGY, INC.)
Contents
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
Organization Name
Inventor(s)
Jonathan S. Hacker of Meridian ID (US)
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18602553 titled 'SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
The semiconductor device described in the patent application includes a substrate with traces protruding above the surface, a prefill material between the traces, a die attached to the substrate, and a wafer-level underfill between the prefill material and the die.
- Traces on the substrate protrude above the surface.
- Prefill material is present between the traces.
- Die is attached to the substrate.
- Wafer-level underfill is between the prefill material and the die.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuits
Problems Solved: - Improved reliability of semiconductor devices - Enhanced performance of electronic components
Benefits: - Increased durability - Better thermal management - Enhanced electrical connectivity
Commercial Applications: Title: Advanced Semiconductor Devices for Enhanced Performance This technology can be used in the production of high-performance electronic devices, leading to improved efficiency and reliability in various industries such as telecommunications, automotive, and consumer electronics.
Questions about the technology: 1. How does the prefill material contribute to the overall performance of the semiconductor device? - The prefill material helps to improve the electrical connectivity and thermal management of the device. 2. What are the advantages of using wafer-level underfill in semiconductor manufacturing? - Wafer-level underfill enhances the reliability and durability of the device by providing mechanical support and protection to the components.
Original Abstract Submitted
A semiconductor device includes a substrate including traces, wherein the traces protrude above a top surface of the substrate; a prefill material over the substrate and between the traces; a die attached over the substrate; and a wafer-level underfill between the prefill material and the die.
