18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Fong-Yuan Chang of Hsinchu (TW)
Po-Hsiang Huang of Tainan City (TW)
Jyh Chwen Frank Lee of Palo Alto CA (US)
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18602533 titled 'INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
Simplified Explanation: The patent application describes a method of forming a semiconductor device by attaching an integrated circuit die to a carrier, removing the carrier, and then attaching a semiconductor package using electrical and thermal connectors.
- Metal posts are formed over the first interconnect structure.
- A thermal dissipation block is formed over the carrier.
- The thermal dissipation block is electrically isolated from external electrical connectors.
- The semiconductor package is attached using first electrical connectors and thermal dissipation connectors.
- External electrical connectors are formed to transmit each external electrical connection into the semiconductor device.
Key Features and Innovation:
- Integration of a thermal dissipation block for heat management.
- Use of metal posts for structural support.
- Electrical isolation of the thermal dissipation block from external connectors.
- Efficient attachment of the semiconductor package using connectors.
Potential Applications: This technology can be applied in the manufacturing of various semiconductor devices, including microprocessors, memory chips, and integrated circuits.
Problems Solved: This method addresses the challenges of heat dissipation and structural integrity in semiconductor devices, ensuring optimal performance and reliability.
Benefits:
- Improved thermal management.
- Enhanced structural support.
- Reliable electrical connections.
- Efficient manufacturing process.
Commercial Applications: The technology can be utilized in the production of high-performance electronic devices for industries such as telecommunications, computing, and automotive.
Prior Art: Readers can explore prior art related to semiconductor device manufacturing processes, thermal dissipation techniques, and electrical connector technologies.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging, thermal management solutions, and interconnect technologies for semiconductor devices.
Questions about Semiconductor Device Formation: 1. How does the integration of a thermal dissipation block improve the performance of semiconductor devices? 2. What are the key differences between this method and traditional semiconductor device manufacturing processes?
Original Abstract Submitted
A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
