18601499. BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Pei Li of Beijing (CN)

Haiwei Sun of Beijing (CN)

Ming Zhai of Beijing (CN)

Lu Yu of Beijing (CN)

Kangle Chang of Beijing (CN)

Jinpeng Li of Beijing (CN)

Pengjun Cao of Beijing (CN)

Yutao Hao of Beijing (CN)

Shubai Zhang of Beijing (CN)

Shuo Wang of Beijing (CN)

Pei Qin of Beijing (CN)

Zewen Gao of Beijing (CN)

Yali Zhang of Beijing (CN)

BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18601499 titled 'BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

The backplane described in the patent application consists of a substrate with a circuit structure layer and a second reflective layer, a first reflective layer on the substrate's bearing surface, multiple light-emitting diode chips, and various optical structures.

• The first reflective layer has spaced-apart through holes where the light-emitting diode chips are placed.
• The light-emitting diode chips are connected to the circuit structure layer for driving them to emit light.
• Each light-emitting diode chip is covered by an optical structure, with the light incident surface in contact with the light exit surface of the chip, and the light exit surface being a curved surface.

Potential Applications: - LED displays - Lighting fixtures - Automotive lighting systems

Problems Solved: - Efficient light emission - Enhanced light distribution - Improved durability of LED chips

Benefits: - Energy efficiency - Brighter and more uniform lighting - Long-lasting performance

Commercial Applications: Title: Advanced LED Backplane Technology for Enhanced Lighting Solutions This technology can be utilized in various commercial applications such as LED billboards, stadium lighting, and automotive headlights, offering superior performance and energy efficiency.

Questions about LED Backplane Technology: 1. How does the optical structure improve the performance of the light-emitting diode chips? 2. What are the key advantages of using a backplane with reflective layers in LED lighting systems?

Frequently Updated Research: Stay updated on the latest advancements in LED backplane technology to ensure optimal performance and efficiency in lighting applications.

Original Abstract Submitted

A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.