18601433. VIA CONNECTION TO A PARTIALLY FILLED TRENCH simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

VIA CONNECTION TO A PARTIALLY FILLED TRENCH

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Shih-Ming Chang of Zhubei City (TW)

Chih-Ming Lai of Hsinchu (TW)

Chung-Ju Lee of Hsinchu City (TW)

Ru-Gun Liu of Zhubei City (TW)

Shau-Lin Shue of Hsinchu (TW)

Tien-I Bao of Dayuan Township (TW)

Tsai-Sheng Gau of Hsinchu City (TW)

VIA CONNECTION TO A PARTIALLY FILLED TRENCH - A simplified explanation of the abstract

This abstract first appeared for US patent application 18601433 titled 'VIA CONNECTION TO A PARTIALLY FILLED TRENCH

The abstract of the patent application describes an integrated circuit structure with two metal features connected by a via, where the top portion of the via is offset from the bottom portion.

• The integrated circuit structure includes a first metal feature in a first dielectric layer.
• A second metal feature is in a second dielectric layer, with the second layer on top of the first layer.
• A via connects the first metal feature to the second metal feature, with an offset between the top and bottom portions of the via.

Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit design

Problems Solved: - Improved connectivity between metal features - Enhanced performance of integrated circuits - Reduction of signal interference

Benefits: - Higher efficiency in data transmission - Increased reliability of integrated circuits - Enhanced overall performance of electronic devices

Commercial Applications: Title: "Advanced Integrated Circuit Structures for Enhanced Performance" This technology can be used in the development of faster and more reliable electronic devices, catering to a wide range of industries such as telecommunications, consumer electronics, and automotive.

Frequently Updated Research: Researchers are continually exploring ways to optimize via structures in integrated circuits for even better performance and reliability.

Questions about Integrated Circuit Structures: 1. How does the offset in the via structure improve the performance of the integrated circuit? 2. What are the potential challenges in manufacturing integrated circuits with such advanced structures?

Original Abstract Submitted

An integrated circuit structure includes a first metal feature formed into a first dielectric layer, a second metal feature formed into a second dielectric layer, the second dielectric layer being disposed on the first dielectric layer, and a via connecting the first metal feature to the second metal feature, wherein a top portion of the via is offset from a bottom portion of the via.