18601337. PRINTED CIRCUIT BOARD simplified abstract (Hamilton Sundstrand Corporation)
Contents
PRINTED CIRCUIT BOARD
Organization Name
Hamilton Sundstrand Corporation
Inventor(s)
Andrew Edward Page of Tring (GB)
Edward Graham Charles Pocock of Birmingham (GB)
PRINTED CIRCUIT BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18601337 titled 'PRINTED CIRCUIT BOARD
Simplified Explanation:
This patent application describes a printed circuit board with a support layer made of a fibre-reinforced epoxy material containing a thermally conductive and electrically insulating filler powder, providing a thermal conductivity of at least 1 W/m.K.
- The circuit layer of the printed circuit board includes an electrical conductor for conducting electricity.
- The support layer is designed to support the circuit layer and enhance thermal conductivity.
- The support layer is made of a fibre-reinforced epoxy material embedded with a filler powder for improved thermal and electrical insulation.
- The support layer has a high thermal conductivity of at least 1 W/m.K, ensuring efficient heat dissipation.
- This innovation aims to improve the thermal performance and reliability of printed circuit boards.
Potential Applications:
- Electronics manufacturing
- Automotive industry
- Aerospace applications
- Telecommunications equipment
Problems Solved:
- Poor thermal management in printed circuit boards
- Limited heat dissipation capabilities
- Reduced reliability due to overheating
Benefits:
- Enhanced thermal conductivity
- Improved heat dissipation
- Increased reliability of electronic devices
Commercial Applications:
Potential commercial applications include the production of high-performance electronic devices, automotive components, and aerospace systems that require efficient heat dissipation and reliable operation.
Questions about Printed Circuit Board Technology: 1. How does the support layer with a thermally conductive filler powder improve the thermal performance of the printed circuit board? 2. What are the specific industries that can benefit the most from this innovation?
Frequently Updated Research:
Ongoing research in the field of printed circuit board materials and thermal management techniques may lead to further advancements in improving the performance and reliability of electronic devices.
Original Abstract Submitted
A printed circuit board includes a circuit layer with an electrical conductor for conducting electricity through the printed circuit board and a support layer for supporting the circuit layer. The support layer include a fibre-reinforced epoxy layer having a thermally conductive and electrically insulating filler powder embedded therein. The support layer has a thermal conductivity of at least 1 W/m.K.
