18601216. ELECTRONIC DEVICE simplified abstract (STMicroelectronics International N.V.)
Contents
ELECTRONIC DEVICE
Organization Name
STMicroelectronics International N.V.
Inventor(s)
Vipin Velayudhan of Grenoble (FR)
ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18601216 titled 'ELECTRONIC DEVICE
The abstract describes a patent application for an integrated circuit chip bonded to a support, with multiple connection pads and a stack of conductive and insulating layers facilitating electrical connections between them.
- The chip has a first connection pad and two second connection pads.
- The support has a third connection pad and two fourth connection pads.
- The stack includes first, second, and third conductive layers separated by insulating layers.
- The second conductive layer connects the first connection pad to the third connection pad.
- The first and third conductive layers connect the second connection pads to the fourth connection pads.
Potential Applications: - This technology can be used in various electronic devices requiring precise electrical connections. - It can be applied in the manufacturing of advanced integrated circuits and microchips.
Problems Solved: - Enables efficient and reliable electrical connections between different components. - Facilitates miniaturization of electronic devices by optimizing space utilization.
Benefits: - Improved performance and reliability of integrated circuits. - Enhanced functionality and connectivity in electronic devices.
Commercial Applications: - This technology has potential applications in the semiconductor industry for producing high-performance electronic devices. - It can be utilized in the development of advanced consumer electronics and communication devices.
Questions about the technology: 1. How does this innovation improve the efficiency of electrical connections in integrated circuits? 2. What are the key advantages of using a stack of conductive and insulating layers in this technology?
Original Abstract Submitted
An integrated circuit chip is bonded to a support. The chip includes a first connection pad and two second connection pads. The support includes a third connection pad and two fourth connection pads. A stack layers includes first, second, and third conductive layers and insulating layers. The first, second, and third conductive layers are separated from one another by the insulating layers. The second conductive layer is positioned between the first and third conductive layers. The first and third conductive layers electrically connect the two second connection pads to the two fourth connection pads. The second conductive layer electrically connects the first connection pad to the third connection pad.
