18600776. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

From WikiPatents
Jump to navigation Jump to search

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Jie Chen of New Taipei City (TW)

Ming-Fa Chen of Taichung City (TW)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18600776 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

The semiconductor package described in the patent application consists of several layers including a semiconductor die, a device layer with an optical device, an insulator layer, a buffer layer, an etch stop layer, a connective terminal, and a bonding via.

  • The semiconductor die is the core component of the package.
  • The device layer contains an optical device for specific functions.
  • The insulator layer provides electrical insulation.
  • The buffer layer serves as a protective barrier.
  • The etch stop layer prevents etching of certain materials.
  • The connective terminal facilitates external connections.
  • The bonding via connects the semiconductor die to the connective terminal.

Potential Applications: - This technology can be used in various electronic devices requiring optical components. - It can be applied in telecommunications, data storage, and sensor systems.

Problems Solved: - Provides a compact and efficient solution for integrating optical devices into semiconductor packages. - Ensures proper electrical connections and insulation within the package.

Benefits: - Improved performance and reliability of electronic devices. - Enhanced functionality with the integration of optical components. - Cost-effective manufacturing process for semiconductor packages.

Commercial Applications: Title: Semiconductor Package with Integrated Optical Device This technology can be utilized in the production of smartphones, cameras, fiber optic communication systems, and medical devices.

Questions about the technology: 1. How does the etch stop layer contribute to the functionality of the semiconductor package? 

  - The etch stop layer prevents unwanted etching of materials, ensuring the integrity of the device layer and insulator layer.

2. What are the advantages of integrating optical devices into semiconductor packages? 

  - Integrating optical devices allows for enhanced functionality and performance in electronic systems.


Original Abstract Submitted

A semiconductor package includes a semiconductor die, a device layer over the semiconductor die and including an optical device, an insulator layer over the device layer, a buffer layer over the insulator layer, an etch stop layer between the device layer and the insulator layer, a connective terminal, and a bonding via passing through the device layer and electrically connecting the semiconductor die to the connective terminal. The conductive terminal passes through the etch stop layer, the insulator layer, and the buffer layer. The conductive terminal is in direct contact with the etch stop layer.

Retrieved from "http://wikipatents.org/index.php?title=18600776._SEMICONDUCTOR_PACKAGE_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79869"