18600738. LIGHT EMITTING DEVICE simplified abstract (NICHIA CORPORATION)
Contents
LIGHT EMITTING DEVICE
Organization Name
Inventor(s)
Soichiro Miura of Tokushima-shi (JP)
Ryota Okuno of Tokushima-shi (JP)
LIGHT EMITTING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18600738 titled 'LIGHT EMITTING DEVICE
The abstract describes a light-emitting device with semiconductor laser elements, light-reflective members, and wires bonded to step-parts on the frame.
- The device includes a base, frame, semiconductor laser elements, light-reflective members, and wires.
- The frame has inner lateral surfaces and step-parts for wire bonding.
- The wires are bonded to the step-parts on the frame.
- The semiconductor laser elements are positioned closer to one of the step-parts.
- This design allows for efficient light emission and control within the device.
Potential Applications: - Laser technology - Lighting systems - Optical communication devices
Problems Solved: - Efficient light emission - Controlled light output - Enhanced performance of semiconductor laser elements
Benefits: - Improved light emission efficiency - Precise control of light output - Enhanced performance of the device
Commercial Applications: Title: Advanced Laser Lighting Systems for Commercial and Industrial Use This technology can be utilized in various industries such as telecommunications, medical equipment, and research laboratories for advanced lighting and laser applications.
Questions about the technology: 1. How does the positioning of the semiconductor laser elements contribute to the efficiency of light emission? - The positioning allows for better control and performance of the light output. 2. What are the potential industrial applications of this light-emitting device? - The device can be used in various industries for lighting, communication, and research purposes.
Original Abstract Submitted
A light emitting device includes a base, a frame, first and second semiconductor laser elements, one or more light-reflective members, and wires. The frame part has first inner lateral surfaces, second inner lateral surfaces, a first and second step-parts respectively formed along the second inner lateral surfaces. The wires are bonded to an upper surface of the first step-part or an upper surface of the second step-part. The first semiconductor laser element is disposed closer to the first step-part.
