18600373. SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Tomoyuki Nagata of Oshu City (JP)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18600373 titled 'SUBSTRATE PROCESSING APPARATUS
Simplified Explanation:
This patent application describes a substrate processing apparatus with a vertical reaction tube and a gas injector that supplies gas into the tube through a horizontal tubular portion.
- The substrate processing apparatus includes a vertical first reaction tube.
- A gas injector supplies gas into the interior of the reaction tube.
- The gas injector has a horizontal tubular portion that passes through the sidewall of the reaction tube.
- A support portion in the reaction tube protrudes towards the center below the tubular portion and supports the gas injector.
Key Features and Innovation:
- Vertical first reaction tube design.
- Horizontal tubular gas injector.
- Support portion for the gas injector within the reaction tube.
Potential Applications:
This technology could be used in semiconductor manufacturing, chemical processing, and other industries that require precise gas injection into reaction chambers.
Problems Solved:
This technology solves the challenge of efficiently and accurately supplying gas into a vertical reaction tube.
Benefits:
- Improved gas injection accuracy.
- Enhanced substrate processing efficiency.
- Increased control over reaction conditions.
Commercial Applications:
Title: Gas Injection System for Vertical Reaction Tubes This technology could be utilized in semiconductor fabrication facilities, chemical production plants, and research laboratories to enhance the quality and efficiency of substrate processing.
Questions about Gas Injection System for Vertical Reaction Tubes:
1. How does the gas injector in this substrate processing apparatus improve efficiency compared to traditional methods? 2. What are the potential cost savings associated with using this gas injection system in industrial applications?
Original Abstract Submitted
A substrate processing apparatus includes: a first reaction tube of a vertical shape; and a gas injector configured to supply a gas to an interior of the first reaction tube, wherein the gas injector has a first tubular portion extending horizontally to pass through a sidewall of the first reaction tube, the first reaction tube has a support portion protruding toward a center of the first reaction tube below the first tubular portion, and the support portion is in contact with the gas injector to support the gas injector.
