18600146. MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE simplified abstract (Micron Technology, Inc.)
Contents
MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE
Organization Name
Inventor(s)
Kunal R. Parekh of Boise ID (US)
MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18600146 titled 'MEMORY DEVICES AND RELATED METHODS OF FORMING A MEMORY DEVICE
The method described in the patent application involves forming a microelectronic device structure with various components, including a base structure, doped semiconductive material, stack structure, cell pillar structures, and digit line structures.
- The process includes attaching an additional microelectronic device structure with control logic devices to form a microelectronic device structure assembly.
- Portions of the base structure and cell pillar structures are removed to expose the doped semiconductive material, which is then patterned to form source structures.
- These source structures are coupled to the cell pillar structures to create microelectronic devices and electronic systems.
Potential Applications: - This technology can be used in the manufacturing of advanced microelectronic devices for various applications such as smartphones, computers, and other electronic devices. - It can also be applied in the development of high-performance integrated circuits for industrial and commercial use.
Problems Solved: - The method addresses the need for efficient and precise formation of microelectronic device structures with complex components. - It streamlines the process of attaching different device structures to create functional electronic systems.
Benefits: - Improved performance and reliability of microelectronic devices. - Enhanced functionality and integration of control logic devices. - Cost-effective manufacturing process for advanced electronic systems.
Commercial Applications: - The technology can be utilized by semiconductor companies for the production of cutting-edge microelectronic devices. - It has potential applications in the telecommunications, automotive, and aerospace industries for developing high-tech electronic systems.
Questions about the technology: 1. How does the method of forming microelectronic device structures differ from traditional manufacturing processes? 2. What are the specific advantages of coupling source structures to cell pillar structures in microelectronic devices?
Original Abstract Submitted
A method of forming a microelectronic device comprises forming a microelectronic device structure comprising a base structure, a doped semiconductive material overlying the base structure, a stack structure overlying the doped semiconductive material, cell pillar structures vertically extending through the stack structure and the doped semiconductive material and into the base structure, and digit line structures vertically overlying the stack structure. An additional microelectronic device structure comprising control logic devices is formed. The microelectronic device structure is attached to the additional microelectronic device structure to form a microelectronic device structure assembly. The base structure and portions of the cell pillar structures vertically extending into the base structure are removed to expose the doped semiconductive material. The doped semiconductive material is then patterned to form at least one source structure over the stack structure and coupled to the cell pillar structures. Microelectronic devices and electronic systems are also described.
