18599734. EMBEDDED STRESS ABSORBER IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
EMBEDDED STRESS ABSORBER IN PACKAGE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Chien-Sheng Chen of Hsinchu (TW)
Po-Yao Lin of Zhudong Township (TW)
Shu-Shen Yeh of Taoyuan City (TW)
EMBEDDED STRESS ABSORBER IN PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18599734 titled 'EMBEDDED STRESS ABSORBER IN PACKAGE
The method described in the patent application involves bonding a first package component over a second package component, which includes multiple dielectric layers and redistribution lines within those layers. Additionally, the method includes dispensing a stress absorber on the second package component, curing the stress absorber, and forming an encapsulant on the second package component and the stress absorber.
- The method involves bonding components in a semiconductor package.
- The second package component has dielectric layers and redistribution lines.
- A stress absorber is dispensed and cured on the second package component.
- An encapsulant is formed on the second package component and the stress absorber.
Potential Applications: - Semiconductor packaging industry - Electronics manufacturing
Problems Solved: - Addressing stress issues in semiconductor packaging - Enhancing the reliability of semiconductor devices
Benefits: - Improved bonding process - Increased durability of semiconductor packages
Commercial Applications: Title: Advanced Semiconductor Packaging Method This technology can be utilized in the semiconductor industry to enhance the reliability and durability of electronic devices. It can be applied in the manufacturing of various electronic products, including smartphones, laptops, and IoT devices.
Questions about the technology: 1. How does the stress absorber contribute to the overall reliability of the semiconductor package? 2. What are the specific advantages of using multiple dielectric layers in the second package component?
Original Abstract Submitted
A method includes bonding a first package component over a second package component. The second package component includes a plurality of dielectric layers, and a plurality of redistribution lines in the plurality of dielectric layers. The method further includes dispensing a stress absorber on the second package component, curing the stress absorber, and forming an encapsulant on the second package component and the stress absorber.
