18599469. CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
Contents
CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE
Organization Name
Inventor(s)
Yonggang Zheng of Dongguan (CN)
CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18599469 titled 'CHIP PACKAGE STRUCTURE, PRODUCTION METHOD FOR CHIP PACKAGE STRUCTURE, AND ELECTRONIC DEVICE
The technology described in this patent application pertains to a chip package structure, a method for producing said structure, and an electronic device. The chip package structure includes multiple layers that enable the direct transmission of signals from the die to external components.
- The chip package structure consists of a first connection layer with upper and lower surfaces, a die placed on the upper surface, a conduction structure on top of the die, a plastic package layer covering the die and conduction structure, and a rewiring layer on top of the plastic package.
- The conduction structure is partially exposed from the plastic package layer, allowing for direct signal transmission.
- The rewiring layer is connected to the conduction structure, facilitating the transfer of signals from the die to external components.
Potential Applications: - This technology can be utilized in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in the automotive industry for advanced driver-assistance systems and infotainment systems.
Problems Solved: - Enables efficient signal transmission from the die to external components. - Enhances the overall performance and reliability of electronic devices.
Benefits: - Improved signal transmission efficiency. - Enhanced performance and reliability of electronic devices. - Simplified production process for chip package structures.
Commercial Applications: Title: Advanced Chip Package Structure for Enhanced Signal Transmission This technology can be commercially applied in the consumer electronics industry for the development of high-performance devices with improved signal transmission capabilities. It can also benefit the automotive sector by enhancing the functionality of in-vehicle electronic systems.
Questions about the technology: 1. How does this chip package structure improve signal transmission efficiency? 2. What are the potential commercial applications of this technology in the consumer electronics industry?
Original Abstract Submitted
The technology of this application relates to a chip package structure, a production method for a chip package structure, and an electronic device. The chip package structure includes a first connection layer having an upper surface and a lower surface that are opposite to each other, a die disposed on the upper surface of the first connection layer, a first conduction structure disposed on an upper surface of the die, a first plastic package layer covering the die and the first conduction structure, and a rewiring layer disposed on the first plastic package layer. At least a part of the first conduction structure is exposed from an upper surface of the first plastic package layer. The rewiring layer is coupled to the first conduction structure. A signal of the die can be directly led out through the first conduction structure and the rewiring layer.
