18599147. Innovative Interconnect Design for Package Architecture to Improve Latency simplified abstract (Intel Corporation)
Contents
Innovative Interconnect Design for Package Architecture to Improve Latency
Organization Name
Inventor(s)
MD Altaf Hossain of Portland OR (US)
Ankireddy Nalamalpu of Portland OR (US)
Dheeraj Subbareddy of Portland OR (US)
Innovative Interconnect Design for Package Architecture to Improve Latency - A simplified explanation of the abstract
This abstract first appeared for US patent application 18599147 titled 'Innovative Interconnect Design for Package Architecture to Improve Latency
Simplified Explanation: The patent application describes an integrated circuit with configurable dies mounted on a package substrate, improving signal latency and circuit operating speed.
Key Features and Innovation:
- Integrated circuit with first and second electrical traces on a package substrate.
- Configurable dies arranged in rows and columns on the substrate.
- Oblique second electrical trace improves signal latency between dies.
- Increased circuit operating speed due to reduced signal delay.
Potential Applications: The technology can be applied in various electronic devices requiring high-speed data processing, such as smartphones, computers, and networking equipment.
Problems Solved: The technology addresses the issue of signal latency in integrated circuits, improving overall performance and speed of data transmission between dies.
Benefits:
- Enhanced circuit operating speed.
- Improved signal latency.
- Increased efficiency in data processing.
Commercial Applications: The technology can be utilized in the development of faster and more efficient electronic devices, potentially impacting industries such as telecommunications, computing, and consumer electronics.
Prior Art: Readers can explore prior research on integrated circuits, signal latency, and die configuration to understand the evolution of this technology.
Frequently Updated Research: Stay informed about advancements in integrated circuit design, signal processing, and semiconductor technology to enhance understanding of the field.
Questions about Integrated Circuits: 1. How does the oblique trace configuration improve signal latency between dies? 2. What are the potential implications of increased circuit operating speed in electronic devices?
Original Abstract Submitted
An integrated circuit includes a package substrate that includes first and second electrical traces. The integrated circuit includes first, second, third, and fourth configurable dies, which are mounted on the package substrate. The first and second configurable dies are arranged in a first row. The third and fourth configurable dies are arranged in a second row, which is approximately parallel to the first row. The first and third configurable dies are arranged in a first column. The second and fourth configurable dies are arranged in a second column, which is approximately parallel to the first column. The first electrical trace couples the first and third configurable dies, and the second electrical trace couples the second and third configurable dies. The second electrical trace is oblique with respect to the first electrical trace. The oblique trace improves the latency of signals transmitted between dies and thereby increases the circuit operating speed.
