18598613. METHOD FOR DETERMINING AMOUNT OF WEAR OF EDGE RING, PLASMA PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM simplified abstract (Tokyo Electron Limited)
METHOD FOR DETERMINING AMOUNT OF WEAR OF EDGE RING, PLASMA PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM
Organization Name
Inventor(s)
Ikko Tanaka of Kurokawa-gun (JP)
Atsushi Terasawa of Kurokawa-gun (JP)
METHOD FOR DETERMINING AMOUNT OF WEAR OF EDGE RING, PLASMA PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18598613 titled 'METHOD FOR DETERMINING AMOUNT OF WEAR OF EDGE RING, PLASMA PROCESSING APPARATUS, AND SUBSTRATE PROCESSING SYSTEM
The method described in the abstract involves generating plasma in a chamber in a plasma processing apparatus, which includes a substrate support with a first portion for supporting a substrate and a second portion for supporting an edge ring. The first portion has a first electrode, and the second portion has a second electrode. The method includes cyclically applying a pulse of voltage to the first and second electrodes to draw ions from the plasma to the substrate support, and determining the wear of the edge ring based on voltage values measured during this process.
- The method involves generating plasma in a chamber in a plasma processing apparatus.
- The substrate support in the apparatus has a first portion for supporting a substrate and a second portion for supporting an edge ring.
- The first portion includes a first electrode, and the second portion includes a second electrode.
- A pulse of voltage is cyclically applied to the first and second electrodes to draw ions from the plasma to the substrate support.
- The wear of the edge ring is determined based on voltage values measured during this process.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production
Problems Solved: - Monitoring and managing wear of edge rings in plasma processing equipment - Ensuring consistent and high-quality substrate processing
Benefits: - Improved process control - Extended equipment lifespan - Enhanced substrate quality and yield
Commercial Applications: Plasma processing equipment manufacturers can integrate this technology to offer more reliable and efficient systems for semiconductor and other industries.
Questions about Plasma Processing Technology: 1. How does this method improve the efficiency of plasma processing equipment? 2. What are the key factors affecting the wear of edge rings in plasma processing systems?
Original Abstract Submitted
A method includes (a) generating plasma in a chamber in a plasma processing apparatus. The plasma processing apparatus includes a substrate support in the chamber. The substrate support includes a first portion to support a substrate and a second portion to support an edge ring. The first portion includes a first electrode, and the second portion includes a second electrode. The method further includes (b) cyclically applying, to draw ions from the plasma to the substrate support, a pulse of a voltage to the first electrode and the second electrode. The method further includes (c) determining an amount of wear of the edge ring based on a first voltage value of the first electrode and a second voltage value of the second electrode measured when the pulse of the voltage is applied to the first electrode and the second electrode.
