18598415. METHOD OF CLEANING WAFER TABLE OF PHOTOLITHOGRAPHY SYSTEM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
METHOD OF CLEANING WAFER TABLE OF PHOTOLITHOGRAPHY SYSTEM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Shih-Yu Tu of Zhubei City (TW)
Shao-Hua Wang of Taoyuan City (TW)
Chueh-Chi Kuo of Kaohsiung City (TW)
Li-Jui Chen of Hsinchu City (TW)
Heng-Hsin Liu of New Taipei City (TW)
METHOD OF CLEANING WAFER TABLE OF PHOTOLITHOGRAPHY SYSTEM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18598415 titled 'METHOD OF CLEANING WAFER TABLE OF PHOTOLITHOGRAPHY SYSTEM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT
The abstract describes a method of cleaning a lithography system, specifically an EUV lithography system, by directing a stream of air through a first opening into a chamber of a wafer table during idle mode. This stream of air extracts particles from surfaces of wafer chucks in the chamber, and the air along with the extracted particles are drawn out through a second opening.
- Air stream directed into wafer table chamber during idle mode
- Particles extracted from wafer chuck surfaces by the air stream
- Extracted particles drawn out of the chamber along with the air
- Cleaning method for lithography system, specifically EUV lithography system
- Utilizes air flow to remove particles from surfaces efficiently
Potential Applications: - Semiconductor manufacturing - Clean room environments - Advanced lithography systems
Problems Solved: - Efficient cleaning of lithography systems - Removal of particles from critical surfaces - Maintenance of system performance
Benefits: - Improved system reliability - Enhanced wafer quality - Reduced downtime for cleaning and maintenance
Commercial Applications: Title: "Advanced Cleaning Method for Lithography Systems" This technology can be used in semiconductor fabrication facilities, clean room environments, and other industries requiring precise cleaning of surfaces for optimal performance.
Questions about the technology: 1. How does the air stream effectively remove particles from the wafer chuck surfaces? - The air stream creates a force that dislodges and carries away particles from the surfaces. 2. What are the potential cost savings associated with implementing this cleaning method in lithography systems? - The reduced downtime for cleaning and maintenance can lead to cost savings in terms of operational efficiency and productivity.
Original Abstract Submitted
In a method of cleaning a lithography system, during idle mode, a stream of air is directed, through a first opening, into a chamber of a wafer table of an EUV lithography system. One or more particles is extracted by the directed stream of air from surfaces of one or more wafer chucks in the chamber of the wafer table. The stream of air and the extracted one or more particle are drawn, through a second opening, out of the chamber of the wafer table.
