18597684. MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract (Intel Corporation)
Contents
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
Organization Name
Inventor(s)
Adel A. Elsherbini of Tempe AZ (US)
Amr Elshazly of Hillsboro OR (US)
Arun Chandrasekhar of Chandler AZ (US)
Shawna M. Liff of Scottsdale AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18597684 titled 'MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
Simplified Explanation: The patent application describes a microelectronic assembly with a communication network between two dies.
Key Features and Innovation:
- Microelectronic assembly with package substrate, first die, and second die.
- Communication network partially included in both dies.
- Communication pathway between the first die and the second die.
Potential Applications: This technology can be used in various electronic devices requiring communication between different components, such as smartphones, tablets, and IoT devices.
Problems Solved: This technology addresses the need for efficient communication pathways between different components in microelectronic assemblies.
Benefits:
- Improved communication efficiency.
- Enhanced performance of electronic devices.
- Compact design for space-constrained applications.
Commercial Applications: Potential commercial applications include consumer electronics, medical devices, automotive electronics, and industrial automation systems.
Questions about Microelectronic Assemblies: 1. How does the communication network improve the performance of microelectronic assemblies? 2. What are the potential challenges in implementing this technology in mass-produced electronic devices?
Frequently Updated Research: Researchers are continuously exploring ways to enhance the speed and reliability of communication networks in microelectronic assemblies. Stay updated on the latest advancements in this field for potential future applications.
Original Abstract Submitted
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
