18597561. OPTICAL SEMICONDUCTOR DEVICE simplified abstract (Sumitomo Electric Industries, Ltd.)

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OPTICAL SEMICONDUCTOR DEVICE

Organization Name

Sumitomo Electric Industries, Ltd.

Inventor(s)

Kosuke Sekiguchi of Osaka-shi (JP)

Keiji Tanaka of Osaka-shi (JP)

OPTICAL SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18597561 titled 'OPTICAL SEMICONDUCTOR DEVICE

The abstract describes an optical semiconductor device with various components embedded in a resin body and covered by a protective film.

  • The device includes an element portion with a mesa protruding portion and a mesa waveguide.
  • First protruding portions on the substrate's principal surface contain the first semiconductor layer.
  • Wiring on the resin body's top surface connects the element portion and the first protruding portions.
  • The protective film covers the wiring and the top surface, ensuring protection.
  • The wiring features an acute angle between the side surface and the top surface, enhancing efficiency.

Potential Applications: This technology can be used in optical communication systems, sensors, and integrated circuits.

Problems Solved: The device addresses the need for compact and efficient optical semiconductor devices with enhanced protection.

Benefits: Improved performance, compact design, enhanced protection, and efficient wiring connectivity.

Commercial Applications: This technology can be applied in telecommunications, data centers, medical devices, and consumer electronics.

Prior Art: Prior research in optical semiconductor devices and integrated circuits can provide valuable insights into the development of this technology.

Frequently Updated Research: Researchers are continuously exploring new materials and designs to enhance the performance of optical semiconductor devices.

Questions about Optical Semiconductor Devices: 1. How does the acute angle in the wiring design improve the device's efficiency? 

  - The acute angle reduces signal loss and enhances signal transmission efficiency.

2. What are the potential challenges in scaling up this technology for mass production? 

  - Challenges may include optimizing manufacturing processes, ensuring consistency in device performance, and managing costs effectively.


Original Abstract Submitted

An optical semiconductor device includes: an element portion provided on a principal surface of a substrate; first protruding portions provided on the principal surface; a resin body including a top surface and embedding the element portion and the first protruding portions; a wiring provided on the top surface; and a protective film covering the top surface and the wiring. The element portion includes a mesa protruding portion including a first semiconductor layer, and a mesa waveguide. The first protruding portions are separated from each other and each includes the first semiconductor layer. The wiring is provided between the first protruding portions and the element portion and includes a side surface adjacent to the first protruding portions. An angle formed by a first portion covering the side surface of the wiring and a second portion covering the top surface and connected to the first portion is acute.

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