18596625. SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR PACKAGES
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hsiang-Ku Shen of Hsinchu City (TW)
Ku-Feng Lin of New Taipei City (TW)
Liang-Wei Wang of Hsinchu City (TW)
SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18596625 titled 'SEMICONDUCTOR PACKAGES
The semiconductor package described in the abstract consists of two integrated circuits, with the first integrated circuit containing a semiconductor substrate, a bonding structure, a ferromagnetic layer, and a memory cell.
- The first integrated circuit includes a semiconductor substrate, a bonding structure, a ferromagnetic layer, and a memory cell.
- The second integrated circuit is also part of the semiconductor package.
- The ferromagnetic layer surrounds the bonding structure of the first integrated circuit.
- The memory cell is positioned between the semiconductor substrate and the bonding structure of the first integrated circuit.
Potential Applications: - This technology could be used in various electronic devices that require memory storage capabilities. - It may find applications in the development of advanced computing systems and data storage solutions.
Problems Solved: - Provides a compact and efficient way to integrate memory cells into semiconductor packages. - Enhances the performance and functionality of electronic devices by incorporating memory storage within the package.
Benefits: - Improved memory storage capacity in semiconductor packages. - Enhanced overall performance and functionality of electronic devices. - Compact design for efficient integration into various applications.
Commercial Applications: Title: Advanced Memory Integration Technology for Electronic Devices This technology could be utilized in the development of smartphones, tablets, laptops, and other consumer electronics that require memory storage capabilities. It could also have applications in industrial automation, automotive electronics, and IoT devices.
Questions about Semiconductor Package Integration Technology: 1. How does the ferromagnetic layer enhance the performance of the semiconductor package? The ferromagnetic layer surrounding the bonding structure helps improve the efficiency and functionality of the memory cell within the semiconductor package by providing additional support and stability.
2. What are the potential market implications of this advanced memory integration technology? The market implications of this technology are significant, as it can lead to the development of more advanced and efficient electronic devices with enhanced memory storage capabilities, catering to a wide range of industries and consumer electronics markets.
Original Abstract Submitted
A semiconductor package includes a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first semiconductor substrate, a first bonding structure bonded to the second integrated circuit, a ferromagnetic layer surrounding the first bonding structure, and a memory cell between the first semiconductor substrate and the first bonding structure.
