18596600. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chung-Ming Weng of Hsinchu (TW)

Chen-Hua Yu of Hsinchu City (TW)

Chung-Shi Liu of Hsinchu City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Hung-Yi Kuo of Taipei City (TW)

Tsung-Yuan Yu of Taipei City (TW)

Hua-Kuei Lin of Hsinchu city (TW)

Che-Hsiang Hsu of Hsinchu (TW)

PACKAGE STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18596600 titled 'PACKAGE STRUCTURE

The patent application describes a package structure consisting of a photonic die, an electronic die, an encapsulant, and a waveguide.

• The photonic die contains an optical coupler, while the electronic die is connected to the photonic die.
• The encapsulant surrounds both the photonic and electronic dies laterally.
• A waveguide is positioned over the encapsulant, with an upper surface facing away from it.
• The waveguide has a first end portion optically coupled to the optical coupler and a second end portion with a groove on the upper surface.

Potential Applications: - Optical communication systems - Integrated photonics devices - High-speed data transmission technologies

Problems Solved: - Efficient integration of photonic and electronic components - Enhanced optical coupling and signal transmission - Improved packaging for compact and reliable devices

Benefits: - Increased data transfer speeds - Reduced signal loss and interference - Compact and reliable packaging design

Commercial Applications: Title: Advanced Integrated Photonic-Electronic Package for High-Speed Data Transmission This technology can be utilized in telecommunications, data centers, and high-performance computing industries for faster and more reliable data transmission.

Prior Art: Researchers can explore existing patents related to integrated photonics, optical coupling, and electronic packaging to understand the background of this technology.

Frequently Updated Research: Researchers are constantly working on improving the efficiency and performance of integrated photonic-electronic packages for various applications.

Questions about the Technology: 1. How does the integration of photonic and electronic components benefit data transmission? 2. What are the key challenges in designing and manufacturing integrated photonic-electronic packages?

Original Abstract Submitted

A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.