18596488. ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract (Intel Corporation)

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

Organization Name

Intel Corporation

Inventor(s)

Tomita Yoshihiro of Tsukuba-shi (JP)

Eric J. Li of Chandler AZ (US)

Shawna M. Liff of Scottsdale AZ (US)

Javier A. Falcon of Chandler AZ (US)

Joshua D. Heppner of Chandler AZ (US)

ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY - A simplified explanation of the abstract

This abstract first appeared for US patent application 18596488 titled 'ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY

The abstract describes molded modules integrated into an electrical package, with components encapsulated within a mold layer and terminals electrically coupled to a redistribution layer on a die.

• Molded modules integrated into an electrical package
• Components encapsulated within a mold layer
• Terminals electrically coupled to a redistribution layer on a die
• Through mold vias for power delivery
• Faraday cages around components

Potential Applications: - Semiconductor packaging - Electronics manufacturing - Integrated circuits

Problems Solved: - Enhancing electrical coupling efficiency - Improving component encapsulation - Providing power delivery through mold vias

Benefits: - Increased reliability - Enhanced performance - Simplified manufacturing processes

Commercial Applications: Title: Advanced Semiconductor Packaging Technology This technology can be used in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics. It can also benefit industries requiring compact and reliable electronic components.

Prior Art: Researchers can explore prior art related to semiconductor packaging, integrated circuits, and electronic component encapsulation.

Frequently Updated Research: Researchers in the field of semiconductor packaging are constantly developing new methods to improve the efficiency and reliability of electronic devices.

Questions about Molded Modules in Electrical Packages: 1. How does the integration of molded modules improve the performance of electronic devices? 2. What are the key advantages of using through mold vias for power delivery in semiconductor packaging?

Original Abstract Submitted

Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.