18595907. ELECTRONIC SYSTEM simplified abstract (MEDIATEK INC.)
Contents
ELECTRONIC SYSTEM
Organization Name
Inventor(s)
Tso-Ju Yi of Hsinchu City (TW)
Chung-Fa Lee of Hsinchu City (TW)
ELECTRONIC SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18595907 titled 'ELECTRONIC SYSTEM
Simplified Explanation: The patent application describes an electronic system with a base and a semiconductor device. The base has a device-attach region with a build-up layer structure, a vertical interconnect structure, and a first through via. The semiconductor device is mounted on this region.
- The electronic system includes a base and a semiconductor device.
- The base has a build-up layer structure, a vertical interconnect structure, and a first through via in the device-attach region.
- The vertical interconnect structure includes a buried via and a blind via connected to it.
- The semiconductor device is mounted on the device-attach region of the base.
Potential Applications: 1. Electronics manufacturing 2. Semiconductor industry 3. Integrated circuit design
Problems Solved: 1. Improved connectivity in electronic systems 2. Enhanced performance of semiconductor devices 3. Streamlined manufacturing processes
Benefits: 1. Increased efficiency in electronic systems 2. Higher reliability of semiconductor devices 3. Simplified assembly of electronic components
Commercial Applications: The technology could be utilized in the production of advanced electronic devices, leading to improved performance and reliability in various industries such as telecommunications, computing, and automotive.
Prior Art: Readers interested in exploring prior art related to this technology may refer to patents in the field of semiconductor device packaging and interconnect technologies.
Frequently Updated Research: Researchers are constantly working on enhancing the design and functionality of semiconductor devices, which may lead to further advancements in electronic systems.
Questions about Electronic Systems: 1. How does the vertical interconnect structure improve the performance of the electronic system? 2. What are the potential challenges in implementing this technology in mass production?
Original Abstract Submitted
An electronic system is provided. The electronic system includes a base and a semiconductor device. The base having a device-attach region includes a build-up layer structure, a vertical interconnect structure and a first through via. The vertical interconnect structure and the first through via are formed passing through the build-up layer structure and located in the device-attach region. The vertical interconnect structure includes a buried via and a blind via electrically coupled to the buried via. The first through via is a straight through via. The semiconductor device is mounted on the device-attach region of the base.
