18595905. SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS simplified abstract (Texas Instruments Incorporated)
Contents
SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
Organization Name
Texas Instruments Incorporated
Inventor(s)
Mutsumi Masumoto of Beppu (JP)
Masamitsu Matsuura of Beppu (JP)
SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18595905 titled 'SEMICONDUCTOR DEVICE HAVING TAPERED METAL COATED SIDEWALLS
Simplified Explanation: The semiconductor device described in the patent application has a semiconductor die with circuitry and bond pads, a metal coating layer covering the bottom side surface and extending to the sidewall surfaces at an angle.
- The semiconductor device includes a semiconductor die with circuitry and bond pads.
- A metal coating layer covers the bottom side surface and extends to the sidewall surfaces.
- The sidewall metal layer is at an angle from 10° to 60° relative to a normal projected from the bottom plane.
Key Features and Innovation:
- Metal coating layer covering the bottom side surface and extending to the sidewall surfaces.
- Sidewall metal layer at an angle from 10° to 60° relative to a normal projected from the bottom plane.
- Improved protection and connectivity for the semiconductor device.
Potential Applications:
- Semiconductor manufacturing industry.
- Electronics and technology sectors.
- Integrated circuits and microelectronics.
Problems Solved:
- Enhanced protection for semiconductor devices.
- Improved connectivity between bond pads and circuitry.
- Better performance and reliability of semiconductor devices.
Benefits:
- Increased durability and longevity of semiconductor devices.
- Enhanced signal transmission and connectivity.
- Improved overall performance of electronic devices.
Commercial Applications: The technology described in the patent application could have significant commercial applications in the semiconductor manufacturing industry, electronics sector, and various other fields requiring high-performance integrated circuits.
Prior Art: Readers interested in exploring prior art related to this technology may consider researching semiconductor device manufacturing processes, metal coating techniques, and semiconductor die packaging methods.
Frequently Updated Research: Researchers and industry professionals may find it beneficial to stay updated on advancements in semiconductor device packaging, metal coating technologies, and circuitry design to further enhance the performance and reliability of electronic devices.
Questions about Semiconductor Device Metal Coating Technology: 1. How does the angle of the sidewall metal layer impact the performance of the semiconductor device? 2. What are the potential challenges in implementing this metal coating technology in mass production processes?
By focusing on the lasting impact and relevance of the technology, this article provides a comprehensive overview of the semiconductor device metal coating innovation described in the patent application.
Original Abstract Submitted
A semiconductor device includes a semiconductor die having a top side surface comprising a semiconductor material including circuitry therein having bond pads connected to nodes in the circuitry, a bottom side surface, and sidewall surfaces between the top side surface and the bottom side surface. A metal coating layer including a bottom side metal layer is over the bottom side surface that extends continuously to a sidewall metal layer on the sidewall surfaces. The sidewall metal layer defines a sidewall plane that is at an angle from 10° to 60° relative to a normal projected from a bottom plane defined by the bottom side metal layer.
