18595890. SUBSTRATE POSITIONING DEVICE, SUBSTRATE POSITIONING METHOD, AND BONDING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
SUBSTRATE POSITIONING DEVICE, SUBSTRATE POSITIONING METHOD, AND BONDING APPARATUS
Organization Name
Inventor(s)
Tetsuya Maki of Koshi City (JP)
SUBSTRATE POSITIONING DEVICE, SUBSTRATE POSITIONING METHOD, AND BONDING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18595890 titled 'SUBSTRATE POSITIONING DEVICE, SUBSTRATE POSITIONING METHOD, AND BONDING APPARATUS
The abstract describes a substrate positioning device that includes a holder for a substrate and a rotating mechanism to rotate the holder. The rotating mechanism consists of a rotation shaft fixed to the holder, a non-contact bearing to support the rotation shaft, a base to fix the bearing, a first driver to rotate the rotation shaft, a damping mechanism to generate a damping force against relative motion, a locking mechanism to lock the moving member of the damping mechanism, and a second driver to micro-drive the damping mechanism.
- The device includes a holder for holding a substrate securely.
- A rotating mechanism allows the holder to rotate for precise positioning.
- A non-contact bearing supports the rotation shaft to minimize friction.
- A damping mechanism generates a damping force to control motion.
- A locking mechanism ensures stability during operation.
- A second driver enables micro-driving of the damping mechanism for fine adjustments.
Potential Applications: - Semiconductor manufacturing - Optoelectronics production - Microelectronics assembly
Problems Solved: - Accurate positioning of delicate substrates - Minimizing vibrations during rotation - Fine-tuning of positioning for precision tasks
Benefits: - Improved accuracy in substrate positioning - Reduced risk of damage to delicate substrates - Enhanced control over rotational movements
Commercial Applications: Title: Precision Substrate Positioning Device for Semiconductor Manufacturing This technology can be used in industries requiring precise substrate handling, such as semiconductor manufacturing, optoelectronics production, and microelectronics assembly. The device's ability to provide accurate positioning and controlled rotation makes it valuable for tasks that demand high precision.
Questions about Substrate Positioning Device: 1. How does the non-contact bearing contribute to the device's performance? The non-contact bearing reduces friction, allowing smooth rotation of the holder for precise substrate positioning.
2. What are the advantages of using a damping mechanism in the rotating mechanism? The damping mechanism generates a damping force to control relative motion, enhancing stability and accuracy in substrate positioning.
Original Abstract Submitted
A substrate positioning device includes a holder configured to hold a substrate; and a rotating mechanism configured to rotate the holder. The rotating mechanism includes a rotation shaft fixed to the holder; a bearing configured to support the rotation shaft in a non-contact manner; a base configured to fix the bearing; a first driver configured to rotate the rotation shaft; a damping mechanism comprising a fixed member connected to one of the base and the rotation shaft, and a moving member connected to the other and configured to be slid with respect to the fixed member, the damping mechanism being configured to generate a damping force against a relative motion between the rotation shaft and the base; a locking mechanism configured to lock the moving member; and a second driver configured to micro-drive the damping mechanism to which the moving member is fixed.
