18594446. ELECTRONIC DEVICE simplified abstract (MEDIATEK INC.)

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ELECTRONIC DEVICE

Organization Name

MEDIATEK INC.

Inventor(s)

Hui-Chi Tang of Hsinchu City (TW)

Shih-Yi Syu of Hsinchu City (TW)

Hao-Ju Wang of Hsinchu City (TW)

Pei-San Chen of Hsinchu City (TW)

Duen-Yi Ho of Hsinchu City (TW)

ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18594446 titled 'ELECTRONIC DEVICE

The abstract describes an electronic device with a base and a semiconductor device mounted on the base. The base has a unit pad array covered by the semiconductor device, with a first pad region for transmitting commands and addresses.

  • The electronic device includes a base with a semiconductor device mounted on top.
  • The base has a unit pad array covered by the semiconductor device.
  • The unit pad array includes a first pad region for transmitting commands and addresses.
  • The first pad region is composed of a first row and a second row, with the first row closer to the device edge.
  • The arrangement of the unit pad array allows for efficient communication with the semiconductor device.

Potential Applications: - This technology can be used in various electronic devices requiring efficient communication between components. - It can be applied in the manufacturing of advanced semiconductor devices for improved functionality.

Problems Solved: - Enhances communication efficiency within electronic devices. - Provides a structured layout for transmitting commands and addresses.

Benefits: - Improved performance and reliability in electronic devices. - Enhanced functionality and communication capabilities. - Streamlined manufacturing processes for semiconductor devices.

Commercial Applications: Title: Advanced Semiconductor Device Communication Technology This technology can be utilized in the production of high-performance electronic devices such as smartphones, tablets, and computers. It can also benefit the semiconductor industry by improving communication efficiency in chip manufacturing processes.

Prior Art: Readers can explore prior patents related to semiconductor device communication technologies to gain a deeper understanding of the advancements in this field.

Frequently Updated Research: Stay updated on the latest research and developments in semiconductor device communication technologies to leverage cutting-edge advancements in electronic device manufacturing.

Questions about Semiconductor Device Communication Technology: 1. How does the arrangement of the unit pad array contribute to efficient communication within the electronic device? 2. What are the potential implications of this technology in the semiconductor industry?


Original Abstract Submitted

An electronic device is provided. The electronic device includes a base and a semiconductor device. The base has a top surface and a bottom surface. The semiconductor device is disposed on the top surface of the base. The semiconductor device has a device edge located within the base in a top view. The base has a unit pad array which is covered by the semiconductor device and electrically connected to the semiconductor device. The unit pad array includes a first pad region composed of a first row and a second row of the unit pad array. The first pad region includes first pads for transmitting commands and addresses to and from the semiconductor device. The first row of the unit pad array is arranged so that it is closer to the device edge than the second row of the unit pad array.