18594415. OPTICAL COUPLER MOISTURE BARRIER simplified abstract (NOKIA SOLUTIONS AND NETWORKS OY)
Contents
OPTICAL COUPLER MOISTURE BARRIER
Organization Name
NOKIA SOLUTIONS AND NETWORKS OY
Inventor(s)
Alexandre Horth of Astoria NY (US)
Michael Hochberg of New York NY (US)
Jiabao Zheng of New York NY (US)
Matthew Streshinsky of New York NY (US)
OPTICAL COUPLER MOISTURE BARRIER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18594415 titled 'OPTICAL COUPLER MOISTURE BARRIER
The abstract describes a method of using atomic layer deposition (ALD) to deposit a multi-layer, thin-film stack on a photonic chip to protect it from damp heat.
- ALD is used to deposit alternating layers of dielectric and moisture barrier layers on the chip.
- The deposited layers are thin enough to be optically compatible with optical input/outputs on the chip.
- The high-quality layers protect the moisture-sensitive oxide layers in the chip.
Potential Applications: - Optical communication systems - Photonic integrated circuits - High-speed data processing applications
Problems Solved: - Sensitivity of photonic chips to damp heat - Degradation of encapsulation oxides in standard wafer fabrication
Benefits: - Improved reliability and longevity of photonic chips - Enhanced performance in harsh environmental conditions
Commercial Applications: Title: "Enhancing Photonic Chip Reliability with ALD Technology" This technology can be used in telecommunications, data centers, and other industries requiring high-performance optical devices.
Prior Art: Researchers can explore prior studies on ALD applications in semiconductor devices and moisture barrier technologies.
Frequently Updated Research: Ongoing research may focus on optimizing the ALD process for even greater protection of photonic chips.
Questions about Photonic Chip Protection: 1. How does ALD technology compare to other methods of protecting photonic chips from damp heat? ALD offers precise control over layer thickness and composition, making it ideal for creating tailored moisture barriers.
2. What are the potential drawbacks or limitations of using ALD for photonic chip protection? While ALD provides excellent protection, it may add complexity and cost to the fabrication process.
Original Abstract Submitted
A photonic chip is especially sensitive to damp heat, because the encapsulation oxides that are used in standard wafer fabrication are typically deposited at lower temperatures and are of lesser quality. Accordingly, atomic layer deposition (ALD) is used to deposit a multi-layer, thin-film stack comprising alternating layers of dielectric layers and moisture barrier layers, e.g. metal oxide or semiconductor nitride, thin enough to be optically compatible with optical input/outputs, such as optical edge couplers in or on the chip. The ALD deposited layers are of high quality and protect the moisture sensitive oxide forming the majority of layers in the chip.
