18594334. SEMICONDUCTOR DEVICE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
Contents
SEMICONDUCTOR DEVICE
Organization Name
TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventor(s)
Yoshitaka Kato of Nisshin-shi (JP)
Takeshi Endo of Nisshin-shi (JP)
Hiroshi Ishino of Nisshin-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18594334 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application consists of a semiconductor module, a wiring substrate, a sealing member, and a thermal diffusion plate. The semiconductor module contains a semiconductor chip with a semiconductor element. The wiring substrate is connected to the semiconductor module, while the sealing member seals both components. The thermal diffusion plate, with higher thermal conductivity than the sealing member, is positioned between the semiconductor module and the wiring substrate in a way that its plane direction is perpendicular to the arrangement direction of the semiconductor module and the wiring substrate.
- The semiconductor device includes a semiconductor module with a semiconductor chip.
- A wiring substrate is electrically connected to the semiconductor module.
- A sealing member seals the semiconductor module and the wiring substrate.
- A thermal diffusion plate, with high thermal conductivity, is placed between the semiconductor module and the wiring substrate.
- The thermal diffusion plate is oriented perpendicular to the arrangement direction of the semiconductor module and the wiring substrate.
Potential Applications: - This technology can be applied in electronic devices requiring efficient heat dissipation. - It can be used in high-performance computing systems to prevent overheating of semiconductor components.
Problems Solved: - Addresses the issue of thermal management in semiconductor devices. - Improves the overall performance and reliability of electronic systems by enhancing heat dissipation.
Benefits: - Enhanced thermal conductivity for better heat dissipation. - Improved longevity and reliability of semiconductor devices. - Increased performance efficiency in electronic systems.
Commercial Applications: Title: Advanced Thermal Management Solutions for Electronic Devices This technology can be utilized in the manufacturing of smartphones, laptops, servers, and other electronic devices to ensure optimal thermal management, leading to improved performance and longevity.
Questions about Semiconductor Device Technology: 1. How does the thermal diffusion plate improve heat dissipation in the semiconductor device?
- The thermal diffusion plate, with higher thermal conductivity, efficiently transfers heat away from the semiconductor module, preventing overheating.
2. What are the potential long-term benefits of implementing this semiconductor device technology in electronic systems?
- The long-term benefits include improved performance, reliability, and longevity of electronic devices due to enhanced thermal management capabilities.
Original Abstract Submitted
A semiconductor device includes a semiconductor module, a wiring substrate, a sealing member, and a thermal diffusion plate. The semiconductor module includes a semiconductor chip in which a semiconductor element is disposed. The wiring substrate is electrically connected to the semiconductor module. The sealing member seals the semiconductor module and the wiring substrate. The thermal diffusion plate is disposed between the semiconductor module and the wiring substrate, and has a thermal conductivity higher than a thermal conductivity of the sealing member. The thermal diffusion plate has a plate shape and is disposed in the sealing member in a state where a plane direction of the thermal diffusion plate is along a direction intersecting an arrangement direction of the semiconductor module and the wiring substrate.
