18593629. DRAWING DEVICE AND DRAWING METHOD simplified abstract (Kioxia Corporation)

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DRAWING DEVICE AND DRAWING METHOD

Organization Name

Kioxia Corporation

Inventor(s)

Yoshinori Kagawa of Shinagawa Tokyo (JP)

DRAWING DEVICE AND DRAWING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18593629 titled 'DRAWING DEVICE AND DRAWING METHOD

The patent application describes a drawing device that uses a beam of charged particles to draw patterns on a target drawing region.

  • The device includes optical elements that control the beam to irradiate divided regions of the target drawing region based on the pattern density.
  • A control computer divides the target drawing region and selectively executes irradiations on the divided regions to ensure the beam reaches the required irradiation amount on each region.

Potential Applications:

  • Semiconductor manufacturing
  • Circuit board fabrication
  • Microelectronics production

Problems Solved:

  • Precise pattern drawing
  • Efficient use of charged particle beams

Benefits:

  • High precision in drawing patterns
  • Increased efficiency in manufacturing processes

Commercial Applications:

  • Semiconductor industry for creating intricate patterns on chips
  • Electronics manufacturing for precise circuit board designs

Questions about the technology: 1. How does the device determine the required irradiation amount for each divided region? 2. What are the advantages of using charged particle beams for drawing patterns compared to other methods?

Frequently Updated Research: Research on optimizing the control algorithms for dividing the target drawing region and executing irradiations efficiently.


Original Abstract Submitted

A drawing device includes a device configured to generate a beam of charged particles, a group of optical elements disposed in a path of the beam, the group of optical elements being controlled so that the beam irradiates each of a plurality of divided regions of a target drawing region on which a pattern is to be drawn with the beam, and a control computer configured to divide the target drawing region into the divided regions based on a density of the pattern, and to execute first to n-th irradiations (n is an integer of 2 or more) selectively on the divided regions so that a total irradiation amount of the beam on each of the divided regions reaches a required irradiation amount therefor.