18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
Organization Name
Inventor(s)
Sunkyoung Seo of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18593381 titled 'SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
The semiconductor package described in the patent application consists of a first semiconductor chip on a wiring structure, internal terminals between the wiring structure and the first semiconductor chip, a high thermal conductivity layer between the wiring structure and the first semiconductor chip, and an encapsulator on the high thermal conductivity layer contacting the second semiconductor chip. The sidewalls of at least the wiring structure and the encapsulator are substantially coplanar.
- The semiconductor package includes a high thermal conductivity layer to improve heat dissipation.
- The coplanar sidewalls of the wiring structure and encapsulator enhance the structural integrity of the package.
- Internal terminals facilitate the connection between the wiring structure and the semiconductor chips.
- The encapsulator provides protection and insulation for the semiconductor chips.
- Overall, the design of this semiconductor package aims to optimize thermal management and structural stability.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, laptops, and servers. - It can also be applied in automotive electronics, industrial equipment, and aerospace systems.
Problems Solved: - Improves heat dissipation in semiconductor packages. - Enhances structural integrity and protection of semiconductor chips.
Benefits: - Better thermal management leads to improved performance and reliability of electronic devices. - Enhanced structural stability increases the lifespan of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Thermal Management This technology can be utilized in the consumer electronics industry, automotive sector, and industrial applications to improve the efficiency and reliability of electronic devices.
Questions about Semiconductor Packaging Technology: 1. How does the high thermal conductivity layer improve heat dissipation in the semiconductor package?
- The high thermal conductivity layer helps to efficiently transfer heat away from the semiconductor chips, preventing overheating and enhancing overall performance.
2. What are the potential commercial applications of this advanced semiconductor packaging technology?
- This technology can be applied in various industries such as consumer electronics, automotive, and aerospace for improved thermal management and reliability.
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip on a wiring structure, a plurality of internal terminals between the wiring structure and the first semiconductor chip; a high thermal conductivity layer is between the wiring structure and the first semiconductor chip; and an encapsulator on the high thermal conductivity layer and contacting the second semiconductor chip. Sidewalls of at least the wiring structure and the encapsulator are substantially coplanar.
