18592829. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18592829 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first chip with a first chip pad on its upper surface, an upper redistribution structure above the first chip, a lowermost via pattern within the upper redistribution structure, and a connection pattern that electrically connects the first chip pad to the lowermost via pattern.
- The first chip pad and the lowermost via pattern do not overlap in a vertical direction, ensuring efficient electrical connections.
- The connection pattern overlaps both the first chip pad and the lowermost via pattern in a vertical direction, enhancing the electrical connection.
- This design allows for improved signal transmission and power distribution within the semiconductor package.
- The non-overlapping arrangement of the first chip pad and the lowermost via pattern helps in reducing signal interference and improving overall performance.
- The vertical overlap of the connection pattern with the first chip pad and the lowermost via pattern ensures reliable electrical connections.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Efficient signal transmission and power distribution within semiconductor packages. - Reduced signal interference and improved overall performance. - Reliable electrical connections in electronic devices.
Benefits: - Enhanced signal transmission efficiency. - Improved power distribution capabilities. - Reliable and stable electrical connections. - Overall improved performance of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the manufacturing of high-performance electronic devices, catering to industries such as consumer electronics, automotive, healthcare, and industrial sectors. The improved signal transmission and power distribution capabilities can lead to more reliable and efficient electronic products, enhancing the overall user experience and market competitiveness.
Questions about Semiconductor Packaging Technology: 1. How does the non-overlapping arrangement of the first chip pad and the lowermost via pattern contribute to signal transmission efficiency?
- The non-overlapping arrangement helps in reducing signal interference and improving overall performance by ensuring a clear path for signal transmission without any obstructions.
2. What are the potential challenges in implementing this advanced semiconductor packaging technology in mass production?
- Some potential challenges could include optimizing manufacturing processes to ensure precise alignment of the various components, as well as testing and quality control measures to guarantee the reliability and performance of the final products.
Original Abstract Submitted
Provided is a semiconductor package including a first chip, a first chip pad on an upper surface of the first chip, an upper redistribution structure above the first chip, a lowermost via pattern within the upper redistribution structure and non-overlapping with the first chip pad in a vertical direction, and a connection pattern electrically connecting the first chip pad to the lowermost via pattern, wherein the connection pattern overlaps each of the first chip pad and the lowermost via pattern in a vertical direction.
