18590718. SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Youngwoo Park of Suwon-Si (KR)
SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18590718 titled 'SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHOD OF FABRICATING THE SAME
The abstract describes semiconductor packages and methods of fabrication involving the formation of a semiconductor chip, an electromagnetic shield covering the chip, and a molding covering the shield, with the shield electrically connected to a conductor on the chip's side.
- Formation of a semiconductor chip
- Creation of an electromagnetic shield to cover the chip
- Application of a molding to cover the shield
- Electrical connection of the shield to a conductor on the chip's side
- Protection and shielding of the semiconductor chip
Potential Applications: - Electronics manufacturing - Semiconductor industry - Consumer electronics
Problems Solved: - Electromagnetic interference - Protection of semiconductor chips - Enhanced durability and reliability
Benefits: - Improved performance of semiconductor devices - Increased longevity of electronic components - Enhanced protection against external factors
Commercial Applications: Title: "Advanced Semiconductor Packaging Technology for Enhanced Performance" This technology can be used in various industries such as telecommunications, automotive, and aerospace for the development of high-performance electronic devices.
Questions about Semiconductor Packaging Technology: 1. How does the electromagnetic shield protect the semiconductor chip from external interference? - The shield acts as a barrier to electromagnetic waves, preventing interference with the chip's operation. 2. What are the advantages of using a molding to cover the electromagnetic shield? - The molding provides additional protection and structural support to the shield, enhancing the overall durability of the semiconductor package.
Original Abstract Submitted
Disclosed are semiconductor packages and methods of fabricating the same. The method inluces forming a semiconductor chip, forming an electromagnetic shield that covers the semiconductor chip, and forming a molding that covers the electromagnetic shield. The electromagnetic shield is electrically connected to a conductor on a side of the semiconductor chip.
