18590415. IMAGING DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
Contents
IMAGING DEVICE
Organization Name
Inventor(s)
YUSUKE Hirano of Kanagawa (JP)
IMAGING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18590415 titled 'IMAGING DEVICE
The abstract of the patent application describes an imaging device with innovative heat dissipation features to improve performance and longevity.
- Image sensor circuit board with mounted image sensor and lens unit for light reception.
- Heat dissipation unit for image sensor circuit board exposed to outside of casing.
- Heat transmission member to transfer heat from image sensor to heat dissipation unit.
- Main circuit board with electronic component and heat transmission member for heat dissipation.
- Heat isolation unit between image sensor and main circuit board heat dissipation units to prevent heat transfer.
Potential Applications: - Surveillance cameras - Medical imaging devices - Automotive cameras
Problems Solved: - Overheating of image sensor and main circuit board - Improved performance and reliability of imaging devices
Benefits: - Extended lifespan of imaging devices - Enhanced image quality due to improved heat management
Commercial Applications: Title: Advanced Heat Dissipation Imaging Devices for Enhanced Performance Potential commercial uses include security systems, medical imaging equipment, and automotive cameras. This technology can improve the reliability and longevity of imaging devices, leading to better performance and customer satisfaction.
Questions about Heat Dissipation in Imaging Devices: 1. How does the heat isolation unit prevent heat transfer between the image sensor and main circuit board? The heat isolation unit is made of a material with lower heat conductivity than the heat dissipation units, effectively blocking heat transfer between the components.
2. What are the potential long-term benefits of implementing advanced heat dissipation features in imaging devices? Implementing advanced heat dissipation features can lead to improved performance, extended lifespan, and enhanced image quality in imaging devices, making them more reliable and efficient over time.
Original Abstract Submitted
An imaging device includes: a casing; an image sensor circuit board housed in the casing and configured such that an image sensor is mounted; a lens unit provided on a light reception surface side of the image sensor and connected to the image sensor circuit board so that the image sensor is housed; an image sensor circuit board heat dissipation unit provided on an opposite side to the light reception surface side of the image sensor circuit board and exposed to outside of the casing; an image sensor heat transmission member configured to transmit heat from the image sensor circuit board to the image sensor circuit board heat dissipation unit; a main circuit board housed in the casing and configured such that an electronic component is mounted; a main circuit board heat transmission member configured to transmit heat from the main circuit board to a main circuit board heat dissipation unit exposed to the outside of the casing; and a heat isolation unit disposed between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit to restrain heat transmission between the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit. The heat isolation unit is formed of a material with lower heat conductivity than materials of the image sensor circuit board heat dissipation unit and the main circuit board heat dissipation unit.
