18590242. INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS simplified abstract (QUALCOMM Incorporated)
Contents
- 1 INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Integrated Circuits with Directly Coupled Metal Lines
- 1.13 Original Abstract Submitted
INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS
Organization Name
Inventor(s)
John Jianhong Zhu of San Diego CA (US)
Junjing Bao of San Diego CA (US)
Giridhar Nallapati of San Diego CA (US)
INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18590242 titled 'INTEGRATED CIRCUITS (ICs) EMPLOYING DIRECTLY COUPLED METAL LINES BETWEEN VERTICALLY-ADJACENT INTERCONNECT LAYERS FOR REDUCED COUPLING RESISTANCE, AND RELATED METHODS
Simplified Explanation
This patent application describes integrated circuits (ICs) that use directly coupled metal lines between vertically-adjacent interconnect layers to reduce coupling resistance. This means that there is no intermediate vertical interconnect access layer with vias connecting the metal lines in different layers.
- Metal lines in overlying and underlying interconnect layers are directly coupled without the need for an intermediate via layer.
Key Features and Innovation
- Integrated circuits with directly coupled metal lines between vertically-adjacent interconnect layers.
- Reduction of coupling resistance in ICs.
- Elimination of the need for an intermediate vertical interconnect access layer with vias.
- Improved performance and efficiency of ICs.
- Related fabrication methods for implementing this innovation.
Potential Applications
This technology can be applied in various electronic devices and systems that use integrated circuits, such as smartphones, computers, and IoT devices.
Problems Solved
- Reduced coupling resistance in ICs.
- Simplified interconnect design.
- Improved signal integrity and performance.
Benefits
- Enhanced efficiency and performance of integrated circuits.
- Simplified fabrication processes.
- Cost-effective production of ICs.
- Improved reliability and signal integrity.
Commercial Applications
This technology has potential commercial applications in the semiconductor industry, specifically in the production of advanced integrated circuits for consumer electronics, telecommunications, and other high-tech devices.
Prior Art
Further research can be conducted on previous patents related to directly coupled metal lines in integrated circuits to understand the evolution of this technology.
Frequently Updated Research
Researchers are continually exploring new methods and materials to further enhance the performance and efficiency of integrated circuits with directly coupled metal lines.
Questions about Integrated Circuits with Directly Coupled Metal Lines
What are the potential challenges in implementing directly coupled metal lines in integrated circuits?
Implementing directly coupled metal lines in integrated circuits may require precise manufacturing processes to ensure proper alignment and connectivity between the metal lines in different layers.
How does the reduction of coupling resistance in ICs impact overall circuit performance?
Reducing coupling resistance in ICs can lead to improved signal integrity, reduced power consumption, and enhanced overall performance of electronic devices that use these integrated circuits.
Original Abstract Submitted
Integrated circuits (ICs), including capacitors and inductors, employing directly coupled metal lines between vertically-adjacent interconnect layers for reduced coupling resistance, and related fabrication methods. By directly coupled, it is meant that there is not an intermediate vertical interconnect access (via) layer with a via(s) interconnecting the metal lines in vertically-adjacent interconnect layers. An overlying and underlying metal line in respective and vertically-adjacent overlying and underlying interconnect layers are directly coupled to each other without the need for an intermediate via layer.
