18589254. METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE simplified abstract (KIOXIA CORPORATION)
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE
Organization Name
Inventor(s)
Shota Konuma of Yokkaichi Mie (JP)
Hiroshi Fujita of Yokohama Kanagawa (JP)
Hisashi Kato of Yokkaichi Mie (JP)
Naomi Yanai of Kuwana Mie (JP)
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18589254 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE, AND METHOD FOR PEELING SUBSTRATE
The method described in the patent application involves manufacturing a semiconductor device by implanting a dopant in an active layer on a substrate, making the active layer porous through an anodization treatment to form a porous layer, creating a device layer above the porous layer, and then cleaving the porous layer to remove the substrate.
- Implanting a dopant in an active layer on a substrate
- Making the active layer porous through an anodization treatment
- Forming a device layer above the porous layer
- Cleaving the porous layer to remove the substrate
Potential Applications: - Semiconductor manufacturing - Electronics industry - Research and development in semiconductor technology
Problems Solved: - Efficient manufacturing of semiconductor devices - Enhanced performance of semiconductor devices - Cost-effective production processes
Benefits: - Improved device performance - Cost savings in manufacturing - Enhanced reliability of semiconductor devices
Commercial Applications: Title: Advanced Semiconductor Device Manufacturing Process This technology can be used in the production of various semiconductor devices, such as microchips, sensors, and integrated circuits. The innovation offers a more efficient and cost-effective method for manufacturing high-performance semiconductor devices, making it highly valuable in the electronics industry.
Questions about Semiconductor Device Manufacturing: 1. How does the anodization treatment contribute to the manufacturing process of semiconductor devices? 2. What are the potential cost savings associated with implementing this method in semiconductor manufacturing?
Frequently Updated Research: Researchers are continually exploring new materials and techniques to further improve the efficiency and performance of semiconductor devices. Stay updated on the latest advancements in semiconductor manufacturing processes to remain competitive in the industry.
Original Abstract Submitted
According to one embodiment, a method for manufacturing a semiconductor device includes forming, on a substrate, an active layer in which a dopant is implanted; forming a porous layer by making the active layer porous by an anodization treatment; forming a device layer including at least a part of a configuration of the semiconductor device above the porous layer; and cleaving the porous layer to remove the substrate.
