18588091. SEMICONDUCTOR DEVICE simplified abstract (Renesas Electronics Corporation)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Renesas Electronics Corporation
Inventor(s)
Takayuki Igarashi of Tokyo (JP)
Yasutaka Nakashiba of Tokyo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18588091 titled 'SEMICONDUCTOR DEVICE
The abstract of the patent application describes a semiconductor chip with a multilayer wiring layer that includes a conductive pattern surrounding a lower inductor and an upper inductor.
- Simplified Explanation:
- The semiconductor chip has a multilayer wiring layer with a conductive pattern. - The conductive pattern surrounds a lower inductor and an upper inductor on the chip.
- Key Features and Innovation:
- Multilayer wiring layer with conductive pattern. - Surrounding lower and upper inductors in plan view.
- Potential Applications:
- Integrated circuits. - Electronic devices. - Communication systems.
- Problems Solved:
- Efficient wiring layout. - Improved performance of inductors.
- Benefits:
- Enhanced functionality. - Space-saving design.
- Commercial Applications:
- Semiconductor industry. - Electronics manufacturing.
- Questions about Semiconductor Chip Technology:
1. How does the conductive pattern improve the performance of inductors on the chip? 2. What are the potential challenges in implementing this technology in mass production?
- Frequently Updated Research:
- Ongoing advancements in semiconductor chip design. - Latest developments in multilayer wiring technology.
Original Abstract Submitted
A semiconductor chip includes a semiconductor substrate and a multilayer wiring layer formed on the semiconductor substrate, and at least one layer of the multilayer wiring layer is formed with a conductive pattern. The conductive pattern is formed so as to continuously surround a lower inductor and an upper inductor in plan view.
