18587908. VERTICALLY MOUNTED DIE GROUPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

VERTICALLY MOUNTED DIE GROUPS

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Jen-Yuan Chang of Hsinchu (TW)

VERTICALLY MOUNTED DIE GROUPS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18587908 titled 'VERTICALLY MOUNTED DIE GROUPS

The semiconductor package described in the patent application consists of a base substrate structure and multiple die groups positioned on the top surface of the base substrate structure. The die groups include a first die group and a second die group that are adjacent to each other.

• The first die group comprises several first dies stacked parallel to each other and parallel to the front surface of the group, with the front surface intersecting the top surface at a first edge extending in a specific direction.
• The second die group consists of multiple second dies stacked parallel to each other and parallel to the front surface of the group, with the front surface intersecting the top surface at a second edge extending in a different direction from the first edge.

Potential Applications: - This technology could be used in the manufacturing of advanced semiconductor devices. - It may find applications in the development of high-performance electronic systems.

Problems Solved: - This innovation addresses the need for compact and efficient semiconductor packaging solutions. - It helps in optimizing the space utilization and performance of semiconductor devices.

Benefits: - Improved integration of multiple dies in a single package. - Enhanced thermal management and overall performance of semiconductor devices.

Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology could be utilized in the production of high-end consumer electronics, automotive systems, and industrial equipment, among other commercial applications. It has the potential to revolutionize the semiconductor packaging industry by offering more efficient and reliable solutions.

Prior Art: Readers can explore prior research on semiconductor packaging technologies, die stacking methods, and thermal management solutions in the semiconductor industry to gain a deeper understanding of the background of this innovation.

Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technologies, die stacking techniques, and thermal management strategies to enhance your knowledge of this field.

Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology improve the performance of electronic devices? 2. What are the key advantages of using die stacking in semiconductor packaging?

Original Abstract Submitted

A semiconductor package includes: a base substrate structure; and a plurality of die groups disposed on a top surface of the based substrate structure, the plurality of die groups comprising a first die group and a second die group neighboring to each other. The first die group includes a plurality of first dies stacked parallel to each other and parallel to a front surface of the first die group, the front surface of the first die group and the top surface intersect at a first edge extending in a first direction. The second die group includes a plurality of second dies stacked parallel to each other and parallel to a front surface of the second die group, the front surface of the second die group and the top surface intersect at a second edge extending in a second direction not parallel to the first direction.