18587832. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (FUJIFILM Corporation)
Contents
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18587832 titled 'ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
The abstract describes an electronic device with a unique electromagnetic wave shielding layer.
- The electronic device includes a wiring board with a ground electrode defining a ground region.
- An electronic component is located on the mounting surface within the ground region.
- An insulating protective layer covers the electronic component within the ground region.
- An electromagnetic wave shielding layer extends over the insulating protective layer and the ground electrode.
- The void ratio of the shielding layer on the ground electrode is lower than on the insulating protective layer.
Potential Applications: - Electronic devices requiring electromagnetic wave shielding. - Communication devices. - Medical equipment.
Problems Solved: - Providing effective electromagnetic wave shielding. - Protecting electronic components from interference.
Benefits: - Improved performance of electronic devices. - Enhanced durability and reliability. - Compliance with electromagnetic interference regulations.
Commercial Applications: - Consumer electronics industry. - Telecommunications sector. - Healthcare technology companies.
Questions about the technology: 1. How does the electromagnetic wave shielding layer improve the performance of electronic devices? 2. What are the specific regulations regarding electromagnetic interference that this technology helps comply with?
Original Abstract Submitted
Provided are: an electronic device including a wiring board having a mounting surface, a ground electrode that defines a ground region on the mounting surface, an electronic component that is located on the mounting surface and is disposed in the ground region, an insulating protective layer that is disposed in the ground region and covers the electronic component, and an electromagnetic wave shielding layer that is provided to extend over the insulating protective layer and the ground electrode and that covers the insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer, in which a void ratio S, which is a void ratio of a portion of the electromagnetic wave shielding layer located on the ground electrode, is lower than a void ratio S, which is a void ratio of a portion of the electromagnetic wave shielding layer located on the insulating protective layer; and a manufacturing method thereof.
