18587589. SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM simplified abstract (CANON KABUSHIKI KAISHA)
Contents
SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM
Organization Name
Inventor(s)
Nobuyuki Endo of Fujisawa-shi (JP)
Tetsuya Itano of Sagamihara-shi (JP)
Kazuo Yamazaki of Yokohama-shi (JP)
Kyouhei Watanabe of Yokohama-shi (JP)
Takeshi Ichikawa of Hachioji-shi (JP)
SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 18587589 titled 'SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM
The patent application describes an apparatus where a first substrate with a photoelectric conversion element and a transistor gate electrode is stacked on top of a second substrate containing a peripheral circuit portion. The first substrate lacks a high-melting-metal compound layer, while the second substrate includes such a layer.
- The apparatus involves stacking substrates with different compositions to achieve specific functionalities.
- The first substrate houses a photoelectric conversion element and a transistor gate electrode.
- The second substrate contains a peripheral circuit portion.
- The absence of a high-melting-metal compound layer in the first substrate distinguishes it from the second substrate.
- The inclusion of a high-melting-metal compound layer in the second substrate provides certain advantages or functionalities.
Potential Applications: - This technology could be used in the development of advanced electronic devices. - It may find applications in the manufacturing of high-performance sensors or imaging devices.
Problems Solved: - The technology addresses the need for improved integration of different components in electronic devices. - It offers a solution for enhancing the performance of photoelectric conversion elements and transistors.
Benefits: - Improved functionality and performance of electronic devices. - Enhanced integration capabilities for different components. - Potential for increased efficiency and reliability in electronic systems.
Commercial Applications: Title: Advanced Electronic Device Manufacturing with Enhanced Integration Capabilities This technology could be utilized in the production of cutting-edge electronic devices with improved performance and functionality. It may have significant implications in industries such as consumer electronics, telecommunications, and healthcare.
Questions about the Technology: 1. How does the absence of a high-melting-metal compound layer in the first substrate impact the overall functionality of the apparatus? 2. What specific advantages does the inclusion of a high-melting-metal compound layer in the second substrate provide in terms of performance and reliability?
Original Abstract Submitted
An apparatus according to the present invention in which a first substrate including a photoelectric conversion element and a gate electrode of a transistor, and a second substrate including a peripheral circuit portion are placed upon each other. The first substrate does not include a high-melting-metal compound layer, and the second substrate includes a high-melting-metal compound layer.
