18587331. FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS simplified abstract (Intel Corporation)
Contents
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
Organization Name
Inventor(s)
Bernd Waidhas of Pettendorf (DE)
Thomas Wagner of Regelsbach (DE)
FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18587331 titled 'FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS
Simplified Explanation: The patent application describes a semiconductor device and method that incorporate peripheral devices, such as capacitors or inductors, into the package. These peripheral devices are of similar thickness to the die or die assembly and are integrated using a fan-out process to create semiconductor devices.
- Peripheral devices like capacitors or inductors are included in the package.
- These peripheral devices have a thickness similar to the die or die assembly.
- Integration is done using a fan-out process to form semiconductor devices.
Key Features and Innovation:
- Inclusion of peripheral devices like capacitors or inductors in the semiconductor package.
- Peripheral devices are of similar thickness to the die or die assembly.
- Utilization of a fan-out process for integrating peripheral devices into semiconductor devices.
Potential Applications: The technology can be applied in the semiconductor industry for the development of advanced semiconductor devices with integrated peripheral components.
Problems Solved: This technology addresses the challenge of incorporating peripheral devices into semiconductor packages without significantly increasing the thickness of the overall package.
Benefits:
- Enhanced functionality of semiconductor devices with integrated peripheral components.
- Improved performance and efficiency of semiconductor devices.
- Cost-effective integration of peripheral devices into semiconductor packages.
Commercial Applications: The technology has potential commercial applications in the semiconductor industry for the production of high-performance semiconductor devices with integrated peripheral components, catering to various electronic applications.
Prior Art: Prior research in the semiconductor industry may have explored methods of integrating peripheral devices into semiconductor packages, but the specific approach outlined in this patent application may offer unique advantages.
Frequently Updated Research: Ongoing research in the semiconductor industry may focus on further optimizing the integration of peripheral devices into semiconductor packages to enhance overall device performance and functionality.
Questions about Semiconductor Device Integration: 1. How does the thickness of the peripheral devices compare to the die or die assembly in this technology? 2. What are the potential challenges in integrating peripheral devices into semiconductor packages using a fan-out process?
Original Abstract Submitted
A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.
