18587031. BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME simplified abstract (YANGTZE MEMORY TECHNOLOGIES CO., LTD.)
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME
Organization Name
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Inventor(s)
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18587031 titled 'BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACCESS MEMORY AND METHODS FOR FORMING THE SAME
The semiconductor device described in the abstract consists of two semiconductor structures, one containing a processor and logic circuit, and the other containing an array of SRAM cells.
- The first semiconductor structure includes a device layer, a first interconnect layer, and a first bonding layer with a bonding contact.
- The second semiconductor structure includes an array of SRAM cells, a second interconnect layer, and a second bonding layer with a bonding contact.
- The processor is connected to the array of SRAM cells through the first interconnect layer, the first bonding contact, the second bonding contact, and the second interconnect layer.
- The logic circuit is also connected to the array of SRAM cells through the same interconnect and bonding layers.
Potential Applications: - This technology can be used in advanced computing devices that require high-speed data processing and storage capabilities. - It can be applied in the development of efficient and compact electronic devices such as smartphones, tablets, and laptops.
Problems Solved: - This innovation addresses the need for integrated semiconductor structures that can efficiently process and store data in a compact form factor. - It solves the challenge of connecting different components within a semiconductor device seamlessly.
Benefits: - Improved performance and efficiency in data processing tasks. - Enhanced reliability and speed in accessing stored data. - Compact design that saves space in electronic devices.
Commercial Applications: Title: Advanced Semiconductor Devices for High-Performance Computing This technology has commercial applications in the development of high-performance computing devices for various industries such as telecommunications, automotive, and consumer electronics.
Questions about the technology: 1. How does the integration of a processor, logic circuit, and SRAM cells benefit the overall performance of the semiconductor device? 2. What are the potential challenges in scaling this technology for mass production in consumer electronics?
Original Abstract Submitted
In an example, a semiconductor device includes a first semiconductor structure including a device layer, a first interconnect layer, and a first bonding layer. The device layer includes a processor and a logic circuit, and the first bonding layer includes a first bonding contact. The semiconductor device also includes a second semiconductor structure including an array of static random-access memory (SRAM) cells, a second interconnect layer, and a second bonding layer including a second bonding contact. The first bonding contact is in contact with the second bonding contact. The processor is electrically connected to the array of SRAM cells through the first interconnect layer, the first bonding contact, the second bonding contact, and the second interconnect layer. The logic circuit is electrically connected to the array of SRAM cells through the first interconnect layer, the first bonding contact, the second bonding contact, and the second interconnect layer.
