18586925. SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Jian-Jou Lian of Tainan City (TW)
Kuo-Bin Huang of Jhubei City (TW)
Li-Min Chen of Zhubei City (TW)
SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18586925 titled 'SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION
Simplified Explanation: The patent application describes methods for forming a conductive feature in a dielectric layer in semiconductor processing, involving a dielectric layer, a surface modification layer, and a conductive feature.
- The structure includes a dielectric layer over a substrate with a sidewall.
- A surface modification layer containing phosphorous and carbon is present along the sidewall.
- A conductive feature is formed along the surface modification layer.
Key Features and Innovation:
- Formation of a conductive feature in a dielectric layer using a surface modification layer.
- Incorporation of phosphorous and carbon in the surface modification layer for enhanced conductivity.
- Precise positioning of the conductive feature along the surface modification layer.
Potential Applications: This technology can be applied in semiconductor manufacturing processes for creating high-performance electronic devices.
Problems Solved:
- Enhances conductivity in dielectric layers.
- Enables precise placement of conductive features.
- Improves overall performance of semiconductor devices.
Benefits:
- Increased efficiency in semiconductor processing.
- Enhanced electrical conductivity.
- Improved functionality of electronic devices.
Commercial Applications: Potential commercial applications include the production of advanced integrated circuits, microprocessors, and other electronic components for various industries.
Prior Art: Readers can explore prior research on surface modification techniques in semiconductor processing to understand the background of this technology.
Frequently Updated Research: Stay updated on advancements in surface modification methods and their impact on semiconductor device performance.
Questions about Conductive Features in Dielectric Layers: 1. How does the incorporation of phosphorous and carbon in the surface modification layer enhance conductivity? 2. What are the potential challenges in scaling up this technology for mass production?
Original Abstract Submitted
Embodiments described herein relate generally to methods for forming a conductive feature in a dielectric layer in semiconductor processing and structures formed thereby. In some embodiments, a structure includes a dielectric layer over a substrate, a surface modification layer, and a conductive feature. The dielectric layer has a sidewall. The surface modification layer is along the sidewall, and the surface modification layer includes phosphorous and carbon. The conductive feature is along the surface modification layer.
