18586919. Photonic Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Photonic Semiconductor Device and Method of Manufacture

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Chung-Ming Weng of Hsinchu (TW)

Chen-Hua Yu of Hsinchu (TW)

Chung-Shi Liu of Hsinchu (TW)

Hao-Yi Tsai of Hsinchu (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Hung-Yi Kuo of Taipei (TW)

Tsung-Yuan Yu of Taipei (TW)

Hua-Kuei Lin of Hsinchu (TW)

Che-Hsiang Hsu of Taichung (TW)

Photonic Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract

This abstract first appeared for US patent application 18586919 titled 'Photonic Semiconductor Device and Method of Manufacture

The patent application describes a package that includes a photonic layer on a substrate, with a silicon waveguide coupled to a grating coupler, an interconnect structure, an electronic die connected to the interconnect structure, a first dielectric layer, a first substrate bonded to the electronic die and the first dielectric layer, a socket attached to the first substrate, and a fiber holder coupled to the first substrate through the socket, which includes a prism to re-orient the optical path of an optical signal.

• Silicon waveguide coupled to a grating coupler
• Interconnect structure over the photonic layer
• Electronic die connected to the interconnect structure
• First substrate bonded to the electronic die and the first dielectric layer
• Socket attached to the first substrate
• Fiber holder with a prism to re-orient the optical path

Potential Applications: - Data communication systems - Telecommunication networks - Optical signal processing

Problems Solved: - Efficient optical signal transmission - Integration of electronic and photonic components - Optimal re-orientation of optical paths

Benefits: - Improved signal quality - Enhanced data transmission speeds - Compact and integrated design

Commercial Applications: - Fiber optic communication equipment - Optical networking devices - High-speed data processing systems

Prior Art: Prior art related to this technology may include patents or research papers on integrated photonic-electronic packages, silicon waveguides, and fiber optic communication systems.

Frequently Updated Research: Ongoing research in the field of integrated photonics and electronic packaging may provide further insights into improving the efficiency and performance of such systems.

Questions about the technology: 1. How does the integration of electronic and photonic components benefit data transmission systems? 2. What are the potential challenges in scaling up the production of such integrated packages?

Original Abstract Submitted

A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.