18586918. POWER CELL FOR SEMICONDUCTOR DEVICES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
Contents
POWER CELL FOR SEMICONDUCTOR DEVICES
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Chung-Chieh Yang of Hsinchu (TW)
Yung-Chow Peng of Hsinchu (TW)
POWER CELL FOR SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18586918 titled 'POWER CELL FOR SEMICONDUCTOR DEVICES
The abstract describes a device with an electrical circuit, a conductive pillar, a conductive rail, and a power pillar connected to the rail.
- The device includes an electrical circuit.
- It has a first conductive pillar on one side of a substrate.
- A first conductive rail is connected to the first conductive pillar.
- The electrical circuit is connected to the first conductive rail through the pillar.
- A power pillar extends through the substrate and is connected to the first conductive rail.
Potential Applications: - This technology could be used in electronic devices requiring efficient power distribution. - It may find applications in the semiconductor industry for improved circuit connectivity.
Problems Solved: - Enhances electrical connectivity within devices. - Facilitates efficient power distribution.
Benefits: - Improved performance and reliability of electronic devices. - Enhanced power distribution capabilities.
Commercial Applications: Title: "Enhancing Power Distribution in Electronic Devices" This technology could be utilized in the manufacturing of smartphones, laptops, and other consumer electronics to improve power distribution efficiency, leading to better device performance and reliability.
Prior Art: Readers can explore prior patents related to electrical circuit connectivity and power distribution in electronic devices to understand the evolution of this technology.
Frequently Updated Research: Stay updated on advancements in power distribution technologies and semiconductor industry developments related to circuit connectivity for electronic devices.
Questions about the Technology: 1. How does this technology improve power distribution efficiency in electronic devices? 2. What are the potential challenges in implementing this technology in mass-produced consumer electronics?
Original Abstract Submitted
A device includes an electrical circuit. The device further includes a first conductive pillar over a first side of a substrate. The device further includes a first conductive rail electrically connected to the first conductive pillar, wherein the electrical circuit is electrically connected to the first conductive rail by the first conductive pillar. The device further includes a power pillar extending through the substrate, wherein the power pillar is electrically connected to the first conductive rail.
