18586310. AUTOMATED SUBSTRATE PLACEMENT TO CHAMBER CENTER simplified abstract (Applied Materials, Inc.)
Contents
- 1 AUTOMATED SUBSTRATE PLACEMENT TO CHAMBER CENTER
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 AUTOMATED SUBSTRATE PLACEMENT TO CHAMBER CENTER - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Substrate Centering
- 1.13 Original Abstract Submitted
AUTOMATED SUBSTRATE PLACEMENT TO CHAMBER CENTER
Organization Name
Inventor(s)
WOLFGANG Aderhold of Santa Clara CA (US)
AUTOMATED SUBSTRATE PLACEMENT TO CHAMBER CENTER - A simplified explanation of the abstract
This abstract first appeared for US patent application 18586310 titled 'AUTOMATED SUBSTRATE PLACEMENT TO CHAMBER CENTER
Simplified Explanation
This patent application describes a method for centering a substrate in a chamber using pyrometers and a robot arm.
Key Features and Innovation
- Method involves inserting substrate into chamber with a robot arm.
- Delta time value obtained for pyrometers to calculate time offset.
- Time offset value compared to a graph or lookup table for distance offset value.
Potential Applications
This technology can be used in semiconductor manufacturing, solar panel production, and other industries requiring precise substrate alignment.
Problems Solved
This method solves the problem of accurately centering substrates in chambers, ensuring optimal performance and quality in manufacturing processes.
Benefits
- Improved accuracy in substrate centering.
- Enhanced efficiency in manufacturing processes.
- Consistent quality control.
Commercial Applications
- Semiconductor manufacturing.
- Solar panel production.
- Optoelectronics industry.
Prior Art
Readers can explore prior art related to substrate centering methods in semiconductor manufacturing and related industries.
Frequently Updated Research
Stay updated on advancements in substrate centering technologies and applications in various industries.
Questions about Substrate Centering
What are the potential challenges in implementing this technology in large-scale manufacturing processes?
Large-scale implementation may require significant calibration and maintenance to ensure accurate substrate centering.
How does this method compare to traditional substrate centering techniques in terms of efficiency and accuracy?
This method offers improved accuracy and efficiency compared to traditional techniques, leading to better manufacturing outcomes.
Original Abstract Submitted
Embodiments disclosed herein include a method of centering a substrate in a chamber. In an embodiment, the method comprises inserting the substrate into the chamber with a robot arm, obtaining a delta time value for a second pyrometer relative to a first pyrometer, where the delta time value is a duration of time between when the first pyrometer is covered by the substrate and when the second pyrometer is covered by the substrate, calculating a time offset value of the delta time value relative to an ideal delta time value, where the ideal delta time value is the delta time value when the substrate is perfectly centered in a first direction perpendicular to the motion of the substrate, and comparing the time offset value to a graph or a lookup table that correlates the time offset value to a distance offset value.
