18586209. MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS simplified abstract (Applied Materials, Inc.)

MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS

Organization Name

Applied Materials, Inc.

Inventor(s)

Randy A. Harris of Kalispell MT (US)

Coby Scott Grove of Whitefish MT (US)

Paul Zachary Wirth of Kalispell MT (US)

Avinash Shantaram of Whitefish MT (US)

Alpay Yilmaz of San Jose CA (US)

Amir Nissan of Sunnyvale CA (US)

Jitendra Ratilal Bhimjiyani of Santa Clara CA (US)

Niranjan Pingle of Milpitas CA (US)

Vincent Dicaprio of Pleasanton CA (US)

MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18586209 titled 'MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS

Simplified Explanation

This patent application describes a multi-chamber processing tool for bonding chiplets to substrates, including various automation modules for efficient processing.

• The tool includes an equipment front end module with loadports for substrates and automation modules with transfer chambers and process chambers.
• Each automation module has a transfer chamber with a buffer and a transfer robot for handling substrates, along with bonder and wet clean chambers.

Key Features and Innovation

• Multi-chamber processing tool for bonding chiplets to substrates.
• Equipment front end module with loadports for receiving substrates.
• Automation modules with transfer chambers, process chambers, bonder chambers, and wet clean chambers.
• Transfer robot for efficient handling of substrates.
• Buffer in transfer chamber for smooth substrate transfer.

Potential Applications

This technology can be used in semiconductor manufacturing, electronics assembly, and other industries requiring precise bonding of chiplets to substrates.

Problems Solved

• Efficient bonding of chiplets to substrates.
• Streamlined substrate handling and processing.
• Improved automation and cleanliness in the bonding process.

Benefits

• Increased productivity and throughput in chiplet bonding.
• Enhanced precision and accuracy in substrate handling.
• Reduced risk of contamination and defects in the bonding process.

Commercial Applications

This technology has potential commercial applications in semiconductor fabrication facilities, electronics manufacturing plants, and research institutions focusing on advanced packaging technologies.

Prior Art

Readers can explore prior art related to multi-chamber processing tools, automation modules in semiconductor manufacturing, and substrate bonding technologies to gain a deeper understanding of the innovation presented in this patent application.

Frequently Updated Research

Stay informed about the latest advancements in multi-chamber processing tools, automation in semiconductor manufacturing, and substrate bonding techniques to keep up with industry trends and developments.

Questions about Multi-Chamber Processing Tools

What are the key components of a multi-chamber processing tool?

A multi-chamber processing tool typically includes equipment front end modules, automation modules, transfer chambers, process chambers, bonder chambers, and wet clean chambers for efficient substrate handling and bonding processes.

How does a transfer robot improve substrate handling in the bonding process?

A transfer robot in the transfer chamber of the automation modules is designed to handle substrates with precision and efficiency, ensuring smooth transfer between chambers for chiplet bonding.

Original Abstract Submitted

Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.